MPC8360VVAGDGA vs MPC8360EZUAGDGA Vergleich
Detaillierter Direktvergleich von MPC8360VVAGDGA von NXP Semiconductors und MPC8360EZUAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC8360VVAGDGA | MPC8360EZUAGDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Core Architecture | PowerPC e300 (Power Architecture technology) | — |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | — |
| Datenbusbreite | 32-bit | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) | MPC8360E |
| Core Supply Voltage (Vcore) | 1.2 V | — |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V | — |
| Betriebstemperaturbereich | 0C to +105C | — |
| Gehäuse | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Memory Interface | DDR1 / DDR2 memory controller | DDR1 / DDR2 |
| PCI Interface | 32-bit PCI v2.3 | 32-bit PCI |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) | 1 Gbit (10/100/1000) |
| USB | 1 x USB 2.0 (host/device) | USB 2.0 full/low-speed |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) | — |
| Serial Interfaces | UART, I2C, SPI, TDM | — |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) | — |
| Architecture | — | PowerPC e300 (Power Architecture) |
| Core Count | — | 1 |
| Core Clock Speed | — | 400 MHz |
| Versorgungsspannung | — | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] |
| TDM / ATM | — | Yes (TDM and ATM) |
| Security Accelerator | — | SEC (crypto engine) |
| Package Height | — | 1.46 mm |
| Lead-Free / RoHS | — | Lead-free (per datasheet) |
| Betriebstemperatur | — | 0 C to 105 C |
| Product Family | — | MPC83xx PowerQUICC II Pro |