MPC852TVR80A vs MPC852TZT80A Comparison
Detailed side-by-side comparison of MPC852TVR80A by NXP Semiconductors and MPC852TZT80A by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC852TVR80A | MPC852TZT80A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.85 | $29.95 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series / Family | MPC8xx / PowerQUICC I | — |
| Core | Power Architecture, 32-bit, 1 core | MPC8xx (32-bit Power Architecture) |
| Core Frequency | 80 MHz | 80 MHz |
| Package | 256-PBGA (23x23 mm, 1.27 mm pitch) | — |
| Operating Temperature | 0 °C to +95 °C | 0 °C to +95 °C |
| Supply Voltage | 3.3 V core with 5 V-tolerant I/O option | 3.3 V |
| Instruction/Data Cache | 8 KB unified | — |
| Communications Module | CPM (Communications Processor Module) with HDLC/Ethernet | — |
| Ethernet Support | Up to 3x Fast Ethernet (10/100) | — |
| PCI Bridge | Integrated PCI bridge | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) | — |
| HTSUS Code | 8542.31.0001 | — |
| RoHS Status | Details not published - verify per lot | Non-Compliant (legacy part) |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Process Technology | — | 0.18 µm CMOS |
| Package Type | — | 256-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 23 x 23 mm |
| Tray Packaging | — | Tray (per distributor listing) |
| Product Category | — | Microprocessors (MPU) |
| Lead Finish | — | Contains lead (SnPb or lead-bearing solder profile) |