MPC852TVR80A vs MPC852TZT80A Comparação
Comparação detalhada lado a lado de MPC852TVR80A por NXP Semiconductors e MPC852TZT80A por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MPC852TVR80A | MPC852TZT80A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Última compra | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $17,85 | $29,95 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series / Family | MPC8xx / PowerQUICC I | — |
| Core | Power Architecture, 32-bit, 1 core | MPC8xx (32-bit Power Architecture) |
| Core Frequency | 80 MHz | 80 MHz |
| Encapsulamento | 256-PBGA (23x23 mm, 1.27 mm pitch) | — |
| Temperatura de operação | 0 °C to +95 °C | 0 °C to +95 °C |
| Tensão de alimentação | 3.3 V core with 5 V-tolerant I/O option | 3.3 V |
| Instruction/Data Cache | 8 KB unified | — |
| Communications Module | CPM (Communications Processor Module) with HDLC/Ethernet | — |
| Ethernet Support | Up to 3x Fast Ethernet (10/100) | — |
| PCI Bridge | Integrated PCI bridge | — |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Nível MSL | 3 (168 hours) | — |
| HTSUS Code | 8542.31.0001 | — |
| Status RoHS | Details not published - verify per lot | Non-Compliant (legacy part) |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Process Technology | — | 0.18 µm CMOS |
| Package Type | — | 256-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 23 x 23 mm |
| Tray Packaging | — | Tray (per distributor listing) |
| Product Category | — | Microprocessors (MPU) |
| Lead Finish | — | Contains lead (SnPb or lead-bearing solder profile) |