MPC852TVR80A vs MPC852TZT80A Comparaison
Comparaison détaillée côte à côte de MPC852TVR80A par NXP Semiconductors et MPC852TZT80A par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MPC852TVR80A | MPC852TZT80A |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $17,85 | $29,95 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series / Family | MPC8xx / PowerQUICC I | — |
| Core | Power Architecture, 32-bit, 1 core | MPC8xx (32-bit Power Architecture) |
| Core Frequency | 80 MHz | 80 MHz |
| Boîtier | 256-PBGA (23x23 mm, 1.27 mm pitch) | — |
| Température de fonctionnement | 0 °C to +95 °C | 0 °C to +95 °C |
| Tension d'alimentation | 3.3 V core with 5 V-tolerant I/O option | 3.3 V |
| Instruction/Data Cache | 8 KB unified | — |
| Communications Module | CPM (Communications Processor Module) with HDLC/Ethernet | — |
| Ethernet Support | Up to 3x Fast Ethernet (10/100) | — |
| PCI Bridge | Integrated PCI bridge | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Niveau MSL | 3 (168 hours) | — |
| HTSUS Code | 8542.31.0001 | — |
| Statut RoHS | Details not published - verify per lot | Non-Compliant (legacy part) |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Process Technology | — | 0.18 µm CMOS |
| Package Type | — | 256-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 23 x 23 mm |
| Tray Packaging | — | Tray (per distributor listing) |
| Product Category | — | Microprocessors (MPU) |
| Lead Finish | — | Contains lead (SnPb or lead-bearing solder profile) |