MPC8541EPXALF vs MPC8541EPXAJD Comparison
Detailed side-by-side comparison of MPC8541EPXALF by NXP Semiconductors and MPC8541EPXAJD by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP
MPC8541EPXALF ⚠ Last Time Buy
Specification Comparison
| Parameter | MPC8541EPXALF | MPC8541EPXAJD |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC III (MPC85xx) | MPC85xx (PowerQUICC III) |
| Core Architecture | PowerPC e500, 32-bit | PowerPC e500 |
| Data Bus Width | 64-bit | 32-bit |
| Core Frequency | 667 MHz | — |
| Supply Voltage | 1.2 V (core); 2.5 V / 3.3 V (I/O) | — |
| Operating Temperature | 0C to +105C | — |
| Package Type | FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip) | — |
| Pin Count | 783 | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 256 KB unified with ECC | — |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) | — |
| Memory Controller | 64-bit DDR/DDR2 with ECC | DDR/DDR2 SDRAM |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | — |
| Mounting Type | Surface Mount (Flip-Chip BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant (per NXP product page) |
| Lead Free | Yes | — |
| Core Count | — | 1 |
| Maximum Core Frequency | — | 533 MHz |
| Package | — | 783-FCPBGA (29x29 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 783 |
| Package Code | — | HBGA |
| Ethernet | — | Dual 10/100/1000 Mbps (TSEC) |
| PCI/PCI-X | — | Dual PCI/PCI-X interface |
| Security Engine (SEC) | — | Integrated crypto accelerator |
| Operating Temperature Grade | — | OTHER (extended) |