MPC8541EPXALF vs MPC8541EPXAJD Vergleich
Detaillierter Direktvergleich von MPC8541EPXALF von NXP Semiconductors und MPC8541EPXAJD von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP
MPC8541EPXALF ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | MPC8541EPXALF | MPC8541EPXAJD |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC III (MPC85xx) | MPC85xx (PowerQUICC III) |
| Core Architecture | PowerPC e500, 32-bit | PowerPC e500 |
| Datenbusbreite | 64-bit | 32-bit |
| Core Frequency | 667 MHz | — |
| Versorgungsspannung | 1.2 V (core); 2.5 V / 3.3 V (I/O) | — |
| Betriebstemperatur | 0C to +105C | — |
| Package Type | FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip) | — |
| Pin-Anzahl | 783 | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 256 KB unified with ECC | — |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) | — |
| Memory Controller | 64-bit DDR/DDR2 with ECC | DDR/DDR2 SDRAM |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | — |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant (per NXP product page) |
| Lead Free | Yes | — |
| Core Count | — | 1 |
| Maximum Core Frequency | — | 533 MHz |
| Gehäuse | — | 783-FCPBGA (29x29 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 783 |
| Package Code | — | HBGA |
| Ethernet | — | Dual 10/100/1000 Mbps (TSEC) |
| PCI/PCI-X | — | Dual PCI/PCI-X interface |
| Security Engine (SEC) | — | Integrated crypto accelerator |
| Operating Temperature Grade | — | OTHER (extended) |