MPC8541EPXALF vs MPC8541EPXAJD 对比
详细并排对比 MPC8541EPXALF 出自 NXP Semiconductors 和 MPC8541EPXAJD 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP
MPC8541EPXALF ⚠ 最后一次采购
规格对比
| 参数 | MPC8541EPXALF | MPC8541EPXAJD |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC III (MPC85xx) | MPC85xx (PowerQUICC III) |
| Core Architecture | PowerPC e500, 32-bit | PowerPC e500 |
| 数据总线宽度 | 64-bit | 32-bit |
| Core Frequency | 667 MHz | — |
| 电源电压 | 1.2 V (core); 2.5 V / 3.3 V (I/O) | — |
| 工作温度 | 0C to +105C | — |
| Package Type | FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip) | — |
| 引脚数量 | 783 | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 256 KB unified with ECC | — |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) | — |
| Memory Controller | 64-bit DDR/DDR2 with ECC | DDR/DDR2 SDRAM |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | — |
| 安装类型 | Surface Mount (Flip-Chip BGA) | Surface Mount |
| RoHS 状态 | Compliant | Compliant (per NXP product page) |
| Lead Free | Yes | — |
| Core Count | — | 1 |
| Maximum Core Frequency | — | 533 MHz |
| 封装 | — | 783-FCPBGA (29x29 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 783 |
| Package Code | — | HBGA |
| Ethernet | — | Dual 10/100/1000 Mbps (TSEC) |
| PCI/PCI-X | — | Dual PCI/PCI-X interface |
| Security Engine (SEC) | — | Integrated crypto accelerator |
| Operating Temperature Grade | — | OTHER (extended) |