MPC8555VTAPF vs MPC8555EPXAPF Comparison
Detailed side-by-side comparison of MPC8555VTAPF by NXP Semiconductors and MPC8555EPXAPF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA
MPC8555VTAPF ✗ End of LifeNXP Semiconductors
MPC8555EPXAPF - PowerQUICC III 833MHz e500 MPU | NXP
MPC8555EPXAPF ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8555VTAPF | MPC8555EPXAPF |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $152.00 | $92.50 |
| Core Processor | PowerPC e500 | — |
| Number of Cores | 1 Core, 32-Bit | — |
| Maximum Core Frequency | 833 MHz | — |
| Co-Processor / DSP | Communications; CPM (Communications Processor Module) | — |
| Memory Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | Yes (per datasheet) | — |
| Ethernet | Dual 10/100/1000 MAC with TCP/IP acceleration | Two 10/100 Fast Ethernet MACs |
| PCI / PCI-X Interfaces | Dual PCI/PCI-X | — |
| Security Engine | IPSec / SSL / TLS / 3DES / AES acceleration | SEC 2.0 (Integrated) |
| Local Bus Controller | Yes | — |
| L1 Cache | 32 KB Instruction + 32 KB Data | — |
| Operating Temperature | -40C to +105C (Industrial / Extended) | — |
| Package | 783-FCPBGA, 29x29 mm | — |
| Mounting Type | Surface Mount (BGA) | — |
| Part Status | Not For New Designs | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Architecture | — | PowerPC e500 (Power Architecture) |
| Core | — | Single e500 |
| Data Bus Width | — | 32-Bit |
| Maximum Clock Speed | — | 833 MHz |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Package Type | — | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) |
| Package Height | — | 3.75 mm |
| Pin Count | — | 783 |
| Operating Temperature Range | — | -40 °C to +85 °C (industrial, extended) |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Memory Controller | — | DDR / DDR2 up to 333 MHz |
| PCI Interface | — | PCI / PCI-X bridge (up to 133 MHz) |
| Process Technology | — | 130 nm CMOS |