MPC8555VTAPF vs MPC8555EPXAPF 比較
詳細な並列比較: MPC8555VTAPF メーカー: NXP Semiconductors および MPC8555EPXAPF メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | MPC8555VTAPF | MPC8555EPXAPF |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | 製造終了 | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $152.00 | $92.50 |
| Core Processor | PowerPC e500 | — |
| Number of Cores | 1 Core, 32-Bit | — |
| Maximum Core Frequency | 833 MHz | — |
| Co-Processor / DSP | Communications; CPM (Communications Processor Module) | — |
| Memory Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | Yes (per datasheet) | — |
| Ethernet | Dual 10/100/1000 MAC with TCP/IP acceleration | Two 10/100 Fast Ethernet MACs |
| PCI / PCI-X Interfaces | Dual PCI/PCI-X | — |
| Security Engine | IPSec / SSL / TLS / 3DES / AES acceleration | SEC 2.0 (Integrated) |
| Local Bus Controller | Yes | — |
| L1 Cache | 32 KB Instruction + 32 KB Data | — |
| 動作温度 | -40C to +105C (Industrial / Extended) | — |
| パッケージ | 783-FCPBGA, 29x29 mm | — |
| 実装タイプ | Surface Mount (BGA) | — |
| Part Status | Not For New Designs | — |
| RoHS ステータス | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Architecture | — | PowerPC e500 (Power Architecture) |
| Core | — | Single e500 |
| データバス幅 | — | 32-Bit |
| Maximum Clock Speed | — | 833 MHz |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Package Type | — | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) |
| Package Height | — | 3.75 mm |
| ピン数 | — | 783 |
| 動作温度範囲 | — | -40 °C to +85 °C (industrial, extended) |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Memory Controller | — | DDR / DDR2 up to 333 MHz |
| PCI Interface | — | PCI / PCI-X bridge (up to 133 MHz) |
| Process Technology | — | 130 nm CMOS |