MPC855TVR66D4 vs MPC860SRVR66D4 Comparison
Detailed side-by-side comparison of MPC855TVR66D4 by NXP Semiconductors and MPC860SRVR66D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ End of LifeNXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Last Time BuySpecification Comparison
| Parameter | MPC855TVR66D4 | MPC860SRVR66D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $55.40 | $89.75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (single core) | — |
| Data Bus Width | 32 bit | — |
| Maximum Clock Frequency | 66 MHz | — |
| Process Technology | 0.32 µm | — |
| Package | 357-PBGA (25x25 mm) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0 °C to +95 °C | -40C to +95C |
| Ethernet Support | Fast Ethernet (100 Mbps) | — |
| Communication Interfaces | ENET, ATM, HDLC, PCMCIA | — |
| Communication Processor Module | Yes (CPM, dedicated RISC engine) | — |
| Category | Microprocessors (MPU) | — |
| Tray Packaging | Tray | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Type | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC 32-bit |
| Number of Cores | — | 1 |
| Clock Speed | — | 66 MHz |
| Operating Voltage | — | 3.3 V (5 V tolerant I/O) |
| Instruction Cache | — | 4 Kbyte |
| Data Cache | — | 4 Kbyte |
| MMU | — | Yes |
| Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/SPI/I2C) |
| Multiply-Accumulate (MAC) Unit | — | Yes |
| JTAG / Debug | — | IEEE 1149.1 compliant |
| Package / Case | — | 357-PBGA (25 mm x 25 mm) |
| Packaging (Shipping) | — | Tray |
| Lead Free Status | — | Lead Free |