MPC855TVR66D4 vs MPC860SRVR66D4 Comparaison
Comparaison détaillée côte à côte de MPC855TVR66D4 par NXP Semiconductors et MPC860SRVR66D4 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ Fin de vieNXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC855TVR66D4 | MPC860SRVR66D4 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $55,40 | $89,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (single core) | — |
| Largeur du bus de données | 32 bit | — |
| Fréquence d'horloge maximale | 66 MHz | — |
| Process Technology | 0.32 µm | — |
| Boîtier | 357-PBGA (25x25 mm) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Température de fonctionnement | 0 °C to +95 °C | -40C to +95C |
| Ethernet Support | Fast Ethernet (100 Mbps) | — |
| Communication Interfaces | ENET, ATM, HDLC, PCMCIA | — |
| Communication Processor Module | Yes (CPM, dedicated RISC engine) | — |
| Catégorie | Microprocessors (MPU) | — |
| Tray Packaging | Tray | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Type | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC 32-bit |
| Number of Cores | — | 1 |
| Clock Speed | — | 66 MHz |
| Operating Voltage | — | 3.3 V (5 V tolerant I/O) |
| Instruction Cache | — | 4 Kbyte |
| Data Cache | — | 4 Kbyte |
| MMU | — | Yes |
| Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/SPI/I2C) |
| Multiply-Accumulate (MAC) Unit | — | Yes |
| JTAG / Debug | — | IEEE 1149.1 compliant |
| Boîtier / Format | — | 357-PBGA (25 mm x 25 mm) |
| Packaging (Shipping) | — | Tray |
| Lead Free Status | — | Lead Free |