MPC855TVR66D4 vs MPC860SRVR66D4 Comparación
Comparación detallada lado a lado de MPC855TVR66D4 por NXP Semiconductors y MPC860SRVR66D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ Fin de vidaNXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Última compraComparación de especificaciones
| Parámetro | MPC855TVR66D4 | MPC860SRVR66D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $55,40 | $89,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (single core) | — |
| Ancho del bus de datos | 32 bit | — |
| Frecuencia de reloj máxima | 66 MHz | — |
| Process Technology | 0.32 µm | — |
| Encapsulado | 357-PBGA (25x25 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0 °C to +95 °C | -40C to +95C |
| Ethernet Support | Fast Ethernet (100 Mbps) | — |
| Communication Interfaces | ENET, ATM, HDLC, PCMCIA | — |
| Communication Processor Module | Yes (CPM, dedicated RISC engine) | — |
| Categoría | Microprocessors (MPU) | — |
| Tray Packaging | Tray | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Type | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC 32-bit |
| Number of Cores | — | 1 |
| Clock Speed | — | 66 MHz |
| Operating Voltage | — | 3.3 V (5 V tolerant I/O) |
| Instruction Cache | — | 4 Kbyte |
| Data Cache | — | 4 Kbyte |
| MMU | — | Yes |
| Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/SPI/I2C) |
| Multiply-Accumulate (MAC) Unit | — | Yes |
| JTAG / Debug | — | IEEE 1149.1 compliant |
| Encapsulado / Carcasa | — | 357-PBGA (25 mm x 25 mm) |
| Packaging (Shipping) | — | Tray |
| Lead Free Status | — | Lead Free |