MPC855TVR66D4 vs MPC860SRVR66D4 Vergleich
Detaillierter Direktvergleich von MPC855TVR66D4 von NXP Semiconductors und MPC860SRVR66D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ AbgekündigtNXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC855TVR66D4 | MPC860SRVR66D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,40 | $89,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (single core) | — |
| Datenbusbreite | 32 bit | — |
| Maximale Taktfrequenz | 66 MHz | — |
| Process Technology | 0.32 µm | — |
| Gehäuse | 357-PBGA (25x25 mm) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0 °C to +95 °C | -40C to +95C |
| Ethernet Support | Fast Ethernet (100 Mbps) | — |
| Communication Interfaces | ENET, ATM, HDLC, PCMCIA | — |
| Communication Processor Module | Yes (CPM, dedicated RISC engine) | — |
| Kategorie | Microprocessors (MPU) | — |
| Tray Packaging | Tray | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Type | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC 32-bit |
| Number of Cores | — | 1 |
| Clock Speed | — | 66 MHz |
| Operating Voltage | — | 3.3 V (5 V tolerant I/O) |
| Instruction Cache | — | 4 Kbyte |
| Data Cache | — | 4 Kbyte |
| MMU | — | Yes |
| Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/SPI/I2C) |
| Multiply-Accumulate (MAC) Unit | — | Yes |
| JTAG / Debug | — | IEEE 1149.1 compliant |
| Gehäuse / Bauform | — | 357-PBGA (25 mm x 25 mm) |
| Packaging (Shipping) | — | Tray |
| Lead Free Status | — | Lead Free |