MPC860DEVR80D4 vs MPC857TZQ80B Comparison

Detailed side-by-side comparison of MPC860DEVR80D4 by NXP Semiconductors and MPC857TZQ80B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC860DEVR80D4 MPC860DEVR80D4 - PowerQUICC MPU 80MHz 357-PBGA | NXP

MPC860DEVR80D4 - PowerQUICC MPU 80MHz 357-PBGA | NXP

MPC860DEVR80D4 ✗ End of Life

Specification Comparison

Parameter MPC860DEVR80D4 MPC857TZQ80B
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status End of Life NRND
Manufacturer NXP Semiconductors —
Series PowerQUICC MPC8xx PowerQUICC, MPC8xx
Core Architecture PowerPC 32-bit RISC PowerPC
Core Count 1 —
Data Bus Width 32-bit 32-Bit
Maximum Clock Frequency 80 MHz —
Operating Process Technology 0.32 um CMOS —
Package Type 357-PBGA (25 x 25 mm) —
Mounting Type Surface Mount Surface Mount
Peripheral Family MPC8xx Communications Processor Module (CPM) —
On-chip Peripherals Ethernet, SCC, SMC, SPI, I2C, timers —
Operating Temperature [DATA_NEEDED: operating temperature range] —
Supply Voltage [DATA_NEEDED: core and I/O supply voltage] —
RoHS Status Compliant (lead-free VR suffix) RoHS (per distributor listing)
Lifecycle Status End of Life (per NXP product page) —
MSL Level [DATA_NEEDED: moisture sensitivity level] —
Processor Type — MPC8xx PowerQUICC, 1 Core, 32-Bit
Core Frequency — 80 MHz
Supply Voltage (I/O) — 3.3 V
Number of Cores — 1
Package / Case — 357-PBGA (25x25 mm)
Packaging — Tray
Lead Free Status — Contains Lead
Terminal Form — Ball
Number of Terminals — 357
Temperature Grade — Other (industrial)

Datasheets & Resources

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