MPC860TVR50D4 vs MPC860TCZQ50D4 Comparison
Detailed side-by-side comparison of MPC860TVR50D4 by NXP Semiconductors and MPC860TCZQ50D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ End of LifeSpecification Comparison
| Parameter | MPC860TVR50D4 | MPC860TCZQ50D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $58.00 | $16.80 |
| Core Architecture | PowerPC 32-bit | PowerPC |
| Core Count | 1 | — |
| Maximum Clock Frequency | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Package / Case | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | 0.32 um CMOS (per FindIC description) |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | Up to 256 MB DRAM with page mode support |
| Operating Temperature Range | -40°C to +95°C | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Series | MPC8xx PowerQUICC | — |
| RoHS Status | [DATA_NEEDED: rohs compliance] | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Core Clock Speed | — | 50 MHz |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Operating Supply Voltage | — | 2 V to 3.6 V (per FindIC comparison page) |
| Package | — | 357-PBGA (25x25 mm), ZQ suffix |
| Operating Temperature | — | -40C to +95C (industrial) |
| Lead-Free | — | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Lifecycle Status | — | End of Life (NXP Last Time Buy window passed) |