MPC860TVR50D4 vs MPC860TCZQ50D4 Vergleich
Detaillierter Direktvergleich von MPC860TVR50D4 von NXP Semiconductors und MPC860TCZQ50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC860TVR50D4 | MPC860TCZQ50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,00 | $16,80 |
| Core Architecture | PowerPC 32-bit | PowerPC |
| Core Count | 1 | — |
| Maximale Taktfrequenz | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Gehäuse / Bauform | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | 0.32 um CMOS (per FindIC description) |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | Up to 256 MB DRAM with page mode support |
| Betriebstemperaturbereich | -40°C to +95°C | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Series | MPC8xx PowerQUICC | — |
| RoHS-Status | [DATA_NEEDED: rohs compliance] | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Core Clock Speed | — | 50 MHz |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Betriebsversorgungsspannung | — | 2 V to 3.6 V (per FindIC comparison page) |
| Gehäuse | — | 357-PBGA (25x25 mm), ZQ suffix |
| Betriebstemperatur | — | -40C to +95C (industrial) |
| Lead-Free | — | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Lebenszyklusstatus | — | End of Life (NXP Last Time Buy window passed) |