MPC860TVR50D4 vs MPC860TCZQ50D4 Comparação
Comparação detalhada lado a lado de MPC860TVR50D4 por NXP Semiconductors e MPC860TCZQ50D4 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ Fim de vidaComparação de especificações
| Parâmetro | MPC860TVR50D4 | MPC860TCZQ50D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Obsolete | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $58,00 | $16,80 |
| Core Architecture | PowerPC 32-bit | PowerPC |
| Core Count | 1 | — |
| Frequência máxima de clock | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Encapsulamento / Caixa | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | 0.32 um CMOS (per FindIC description) |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | Up to 256 MB DRAM with page mode support |
| Faixa de temperatura de operação | -40°C to +95°C | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Series | MPC8xx PowerQUICC | — |
| Status RoHS | [DATA_NEEDED: rohs compliance] | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Core Clock Speed | — | 50 MHz |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Tensão de alimentação de operação | — | 2 V to 3.6 V (per FindIC comparison page) |
| Encapsulamento | — | 357-PBGA (25x25 mm), ZQ suffix |
| Temperatura de operação | — | -40C to +95C (industrial) |
| Lead-Free | — | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Status do ciclo de vida | — | End of Life (NXP Last Time Buy window passed) |