MPC875VR133 vs MPC875CVR133 Comparison
Detailed side-by-side comparison of MPC875VR133 by NXP Semiconductors and MPC875CVR133 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC875VR133 | MPC875CVR133 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $27.90 | $43.75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture (32-bit RISC) | — |
| Core Count | 1 | — |
| Core Frequency | 133 MHz | — |
| Performance | 176 MIPS | 176 MIPS |
| Data Bus Width | 32 bit | 32-bit |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Operating Temperature | 0 °C to +95 °C | -40C to +100C |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xx / PowerQUICC |
| Core | — | MPC8xx (Power Architecture Technology) |
| Maximum Clock Frequency | — | 133 MHz |
| Number of Cores | — | 1 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Package | — | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) |
| On-chip Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/USB/FEC/ATM) |