MPC875VR133 vs MPC875CVR133 Vergleich
Detaillierter Direktvergleich von MPC875VR133 von NXP Semiconductors und MPC875CVR133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC875VR133 | MPC875CVR133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,90 | $43,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture (32-bit RISC) | — |
| Core Count | 1 | — |
| Core Frequency | 133 MHz | — |
| Performance | 176 MIPS | 176 MIPS |
| Datenbusbreite | 32 bit | 32-bit |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Betriebstemperatur | 0 °C to +95 °C | -40C to +100C |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xx / PowerQUICC |
| Core | — | MPC8xx (Power Architecture Technology) |
| Maximale Taktfrequenz | — | 133 MHz |
| Number of Cores | — | 1 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Gehäuse | — | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) |
| On-chip Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/USB/FEC/ATM) |