MPX2100DP vs MPX2100D Comparison
Detailed side-by-side comparison of MPX2100DP by NXP Semiconductors and MPX2100D by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPX2100DP | MPX2100D |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Pressure Sensors | Pressure Sensors |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $5.95 | $17.80 |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 100 kPa (0 to 14.5 psi) | 0 kPa to 100 kPa (0 to 14.5 psi) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Full-Scale Span (Typical) | 40 mV (at 10 V excitation) | 40 mV at 10 V excitation |
| Zero Pressure Offset | [DATA_NEEDED: zero pressure offset] | — |
| Linearity | 1% typical | 0.1% to 0.3% typical [DATA_NEEDED: confirm] |
| Supply Voltage | 10 V DC typical | — |
| Supply Current | [DATA_NEEDED: supply current] | — |
| Output Type | Analog mV (Wheatstone Bridge) | Analog ratiometric Wheatstone bridge (millivolts) |
| Operating Temperature | 0C to +85C (compensated) | — |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Port Configuration | Dual port, axial tube, 4.93 mm (0.19 in) | — |
| Package / Case | 4-SIP Module (Case 344C-01) | — |
| Mounting Type | Through-Hole | Through-hole SIP module |
| Technology | Silicon piezoresistive, on-chip temperature compensation | Silicon piezoresistive MEMS strain-gauge bridge |
| RoHS Status | Compliant | Compliant [DATA_NEEDED: confirm from NXP product page] |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| Sensitivity (Nominal) | — | 0.4 mV/kPa |
| Supply Voltage (Recommended) | — | 10 V DC |
| Supply Voltage (Maximum) | — | 16 V DC |
| Pressure Port Configuration | — | Dual axial ports (differential) |
| Package | — | 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch |
| Package Body Dimensions | — | 15.56 mm x 15.56 mm x 5.33 mm |
| Operating Temperature Range | — | -40C to +125C [DATA_NEEDED: confirm exact range from datasheet] |
| On-Chip Temperature Compensation | — | Yes (factory laser-trimmed) |
| Diaphragm Material | — | Silicon [DATA_NEEDED: confirm] |