MSC8157TVT1000A vs MSC8157ETVT1000A Comparison
Detailed side-by-side comparison of MSC8157TVT1000A by NXP Semiconductors and MSC8157ETVT1000A by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MSC8157TVT1000A - 6-Core SC3850 DSP 1GHz 783-FCBGA | NXP
MSC8157TVT1000A ObsoleteNXP Semiconductors
MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP
MSC8157ETVT1000A ObsoleteSpecification Comparison
| Parameter | MSC8157TVT1000A | MSC8157ETVT1000A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | DSP |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $171.00 | $190.89 |
| Series | StarCore | StarCore |
| Type | SC3850 Six-Core Digital Signal Processor | SC3850 Six-Core Digital Signal Processor (DSP) |
| Data Bus Width | 32-Bit / 64-Bit | 64-bit |
| Core Architecture | StarCore SC3850 | — |
| Number of Cores | 6 | — |
| Clock Rate | 1 GHz | 1 GHz (1000 MHz) |
| Performance | 1000 MIPS per core (up to 6000 MIPS aggregate) | — |
| Package Type | FCBGA-783 (29 mm x 29 mm) | — |
| Pin Count | 783 | 783 |
| Mounting Type | Surface Mount (BGA) | Surface Mount (FCBGA) |
| Operating Temperature | -40 C to +105 C | -40°C to +105°C (Extended) |
| Voltage - Core (Vccint) | 1.0 V | — |
| Voltage - I/O | 1.0 V / 1.5 V / 2.5 V | 1.0 V / 1.5 V / 2.5 V (selectable) |
| On-Chip RAM | 6.375 MB | 6.375 MB |
| Non-Volatile Memory (ROM) | 96 kB | — |
| Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO |
| Memory Controller | DDR2 / DDR3 (32-bit / 64-bit) | — |
| RoHS Status | Lead-free (per FCBGA marking) | — |
| Status | Obsolete (EOL) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Architecture | — | StarCore SC3850, six independent cores |
| Core Count | — | 6 |
| On-Chip ROM | — | 96 kB |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Voltage - Core | — | 1.0 V |
| Package | — | 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm |
| Lead Status | — | Lead Free |
| Process Technology | — | CMOS |