MSC8157TVT1000A vs MSC8157ETVT1000A Vergleich
Detaillierter Direktvergleich von MSC8157TVT1000A von NXP Semiconductors und MSC8157ETVT1000A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8157TVT1000A - 6-Core SC3850 DSP 1GHz 783-FCBGA | NXP
MSC8157TVT1000A ObsoleteNXP Semiconductors
MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP
MSC8157ETVT1000A ObsoleteSpezifikationsvergleich
| Parameter | MSC8157TVT1000A | MSC8157ETVT1000A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $190,89 |
| Series | StarCore | StarCore |
| Type | SC3850 Six-Core Digital Signal Processor | SC3850 Six-Core Digital Signal Processor (DSP) |
| Datenbusbreite | 32-Bit / 64-Bit | 64-bit |
| Core Architecture | StarCore SC3850 | — |
| Number of Cores | 6 | — |
| Clock Rate | 1 GHz | 1 GHz (1000 MHz) |
| Performance | 1000 MIPS per core (up to 6000 MIPS aggregate) | — |
| Package Type | FCBGA-783 (29 mm x 29 mm) | — |
| Pin-Anzahl | 783 | 783 |
| Montageart | Surface Mount (BGA) | Surface Mount (FCBGA) |
| Betriebstemperatur | -40 C to +105 C | -40°C to +105°C (Extended) |
| Voltage - Core (Vccint) | 1.0 V | — |
| Voltage - I/O | 1.0 V / 1.5 V / 2.5 V | 1.0 V / 1.5 V / 2.5 V (selectable) |
| On-Chip RAM | 6.375 MB | 6.375 MB |
| Non-Volatile Memory (ROM) | 96 kB | — |
| Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO |
| Memory Controller | DDR2 / DDR3 (32-bit / 64-bit) | — |
| RoHS-Status | Lead-free (per FCBGA marking) | — |
| Status | Obsolete (EOL) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Architecture | — | StarCore SC3850, six independent cores |
| Core Count | — | 6 |
| On-Chip ROM | — | 96 kB |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Voltage - Core | — | 1.0 V |
| Gehäuse | — | 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm |
| Lead Status | — | Lead Free |
| Process Technology | — | CMOS |