MSC8157TVT1000A vs MSC8157ETVT1000A Сравнение
Подробное сравнение бок о бок MSC8157TVT1000A от NXP Semiconductors и MSC8157ETVT1000A от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MSC8157TVT1000A - 6-Core SC3850 DSP 1GHz 783-FCBGA | NXP
MSC8157TVT1000A ObsoleteNXP Semiconductors
MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP
MSC8157ETVT1000A ObsoleteСравнение характеристик
| Параметр | MSC8157TVT1000A | MSC8157ETVT1000A |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | DSP | DSP |
| Статус жизненного цикла | Obsolete | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $171,00 | $190,89 |
| Series | StarCore | StarCore |
| Type | SC3850 Six-Core Digital Signal Processor | SC3850 Six-Core Digital Signal Processor (DSP) |
| Разрядность шины данных | 32-Bit / 64-Bit | 64-bit |
| Core Architecture | StarCore SC3850 | — |
| Number of Cores | 6 | — |
| Clock Rate | 1 GHz | 1 GHz (1000 MHz) |
| Performance | 1000 MIPS per core (up to 6000 MIPS aggregate) | — |
| Package Type | FCBGA-783 (29 mm x 29 mm) | — |
| Число выводов | 783 | 783 |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (FCBGA) |
| Рабочая температура | -40 C to +105 C | -40°C to +105°C (Extended) |
| Voltage - Core (Vccint) | 1.0 V | — |
| Voltage - I/O | 1.0 V / 1.5 V / 2.5 V | 1.0 V / 1.5 V / 2.5 V (selectable) |
| On-Chip RAM | 6.375 MB | 6.375 MB |
| Non-Volatile Memory (ROM) | 96 kB | — |
| Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO |
| Memory Controller | DDR2 / DDR3 (32-bit / 64-bit) | — |
| Статус RoHS | Lead-free (per FCBGA marking) | — |
| Status | Obsolete (EOL) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Architecture | — | StarCore SC3850, six independent cores |
| Core Count | — | 6 |
| On-Chip ROM | — | 96 kB |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Voltage - Core | — | 1.0 V |
| Корпус | — | 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm |
| Lead Status | — | Lead Free |
| Process Technology | — | CMOS |