MSC8251SVT1000B vs MSC8157TAG1000A Comparison

Detailed side-by-side comparison of MSC8251SVT1000B by NXP Semiconductors and MSC8157TAG1000A by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete
NXP Semiconductors
MSC8157TAG1000A MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A ⚠ Last Time Buy

Specification Comparison

Parameter MSC8251SVT1000B MSC8157TAG1000A
Brand NXP Semiconductors NXP Semiconductors
Category DSP DSP
Lifecycle Status Obsolete Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $65.00 $178.00
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Core Architecture SC3850 StarCore, single core —
Core Revision StarCore R2.1 —
Maximum Core Clock 1 GHz —
MIPS [DATA_NEEDED: MIPS rating for 1 GHz SC3850] —
L1 Instruction Cache 32 KB 32 KB per core
L1 Data Cache 32 KB 32 KB per core
L2 Unified Cache 512 KB (configurable, SRAM or MAP) —
On-Chip RAM 576 KB —
Internal ROM 96 KB —
TDM Interfaces 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support —
Ethernet MAC Yes (integrated) —
PCI Express Yes (integrated controller) —
Serial RapidIO Yes (SERDES-based) —
DMA Controller Multi-channel DMA —
Package Type FCBGA (Flip-Chip Ball Grid Array) —
Package Pin Count 783 balls —
Package Dimensions 29 mm x 29 mm —
Mounting Type Surface Mount —
Lead-Free / Halogen-Free Yes (lead-free, halogen-free package) —
RoHS Status Compliant [DATA_NEEDED]
Operating Temperature [DATA_NEEDED: operating temperature grade] -40C to +105C
Device Type — Six-core Digital Signal Processor (DSP)
DSP Architecture — StarCore SC3850 (6x cores)
Core Frequency — 1 GHz per core
Unified L2 Cache — 512 KB (configurable as M2 in 64 KB increments)
Accelerator — MAPLE-B2 baseband accelerator
Memory Controller — Dual-channel DDR2/DDR3 with ECC
High-Speed Serial I/O — 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI
Package — 783-FCPBGA (29x29 mm)
Ball Pitch — 1.0 mm
Supply Voltage — [DATA_NEEDED: core/IO voltage]
MMU — Yes
Interrupt Controller — EPIC (Extended Programmable Interrupt Controller)
Timers — 2x 32-bit general-purpose per core
MSL Level — [DATA_NEEDED]

Datasheets & Resources

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