MSC8251SVT1000B vs MSC8157TAG1000A Comparação

Comparação detalhada lado a lado de MSC8251SVT1000B por NXP Semiconductors e MSC8157TAG1000A por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete
NXP Semiconductors
MSC8157TAG1000A MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A ⚠ Última compra

Comparação de especificações

Parâmetro MSC8251SVT1000B MSC8157TAG1000A
Marca NXP Semiconductors NXP Semiconductors
Categoria DSP DSP
Status do ciclo de vida Obsolete Última compra
Status do estoque In Stock In Stock
Preço unitário (USD) $65,00 $178,00
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Core Architecture SC3850 StarCore, single core —
Core Revision StarCore R2.1 —
Maximum Core Clock 1 GHz —
MIPS [DATA_NEEDED: MIPS rating for 1 GHz SC3850] —
L1 Instruction Cache 32 KB 32 KB per core
L1 Data Cache 32 KB 32 KB per core
L2 Unified Cache 512 KB (configurable, SRAM or MAP) —
On-Chip RAM 576 KB —
Internal ROM 96 KB —
TDM Interfaces 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support —
Ethernet MAC Yes (integrated) —
PCI Express Yes (integrated controller) —
Serial RapidIO Yes (SERDES-based) —
DMA Controller Multi-channel DMA —
Package Type FCBGA (Flip-Chip Ball Grid Array) —
Package Pin Count 783 balls —
Package Dimensions 29 mm x 29 mm —
Tipo de montagem Surface Mount —
Lead-Free / Halogen-Free Yes (lead-free, halogen-free package) —
Status RoHS Compliant [DATA_NEEDED]
Temperatura de operação [DATA_NEEDED: operating temperature grade] -40C to +105C
Device Type — Six-core Digital Signal Processor (DSP)
DSP Architecture — StarCore SC3850 (6x cores)
Core Frequency — 1 GHz per core
Unified L2 Cache — 512 KB (configurable as M2 in 64 KB increments)
Accelerator — MAPLE-B2 baseband accelerator
Memory Controller — Dual-channel DDR2/DDR3 with ECC
High-Speed Serial I/O — 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI
Encapsulamento — 783-FCPBGA (29x29 mm)
Ball Pitch — 1.0 mm
Tensão de alimentação — [DATA_NEEDED: core/IO voltage]
MMU — Yes
Interrupt Controller — EPIC (Extended Programmable Interrupt Controller)
Timers — 2x 32-bit general-purpose per core
Nível MSL — [DATA_NEEDED]

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