MT40A2G8AG-062E vs H5ANAG8NAMR-UHC Comparison
Detailed side-by-side comparison of MT40A2G8AG-062E by Micron Technology and H5ANAG8NAMR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MT40A2G8AG-062E | H5ANAG8NAMR-UHC |
|---|---|---|
| Brand | Micron Technology | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.75 | $2.15 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gbit |
| Organization | 2G x 8 | 2G x 8 |
| Speed | DDR4-3200 (3200 MT/s) | — |
| Clock Frequency | 1600 MHz | — |
| Access Time (Clock Cycle Time) | 0.625 ns (tCK) | — |
| CAS Latency | CL22 (DDR4-3200) | — |
| Access Time | 19 ns | — |
| Supply Voltage VDD | 1.2 V | — |
| I/O Interface | POD12 (1.2 V pseudo-open drain) | — |
| VPP Voltage | 2.5 V | — |
| Number of Banks | 16 (4 bank groups x 4 banks) | — |
| Operating Temperature (AUT grade) | -40C to +95C (per Micron grade table) | — |
| Package | 78-FBGA (7.5 x 11 mm) | FBGA-78 |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant (lead-free FBGA package) |
| Die Revision | AG (current generation) | — |
| Manufacturer | — | SK Hynix |
| Data Rate | — | DDR4-2400 (2400 MT/s) |
| Supply Voltage | — | 1.2 V |
| Interface | — | Parallel, DDR4 |
| Bank Group Architecture | — | DDR4 bank-group architecture |
| On-Die Termination (ODT) | — | Yes |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| Refresh | — | Self-refresh and auto-refresh (DDR4) |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Applications | — | Data storage, firmware boot, industrial controllers, computing modules |