N25Q064A13ESEA0F vs W25Q64JVSSIG Comparison

Detailed side-by-side comparison of N25Q064A13ESEA0F by Micron Technology and W25Q64JVSSIG by Winbond. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
N25Q064A13ESEA0F N25Q064A13ESEA0F - 64Mb SPI NOR Flash 108MHz | Micron

N25Q064A13ESEA0F - 64Mb SPI NOR Flash 108MHz | Micron

N25Q064A13ESEA0F ✓ Active

Specification Comparison

Parameter N25Q064A13ESEA0F W25Q64JVSSIG
Brand Micron Technology Winbond
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $0.22
Memory Type NOR Flash - Serial SPI NOR Flash (SPI)
Memory Size 64 Mbit (8 MB) —
Interface SPI (1-bit / 2-bit / 4-bit) SPI, Dual SPI, Quad SPI, QPI
Max Clock Frequency 108 MHz —
Supply Voltage 3 V (2.7 V to 3.6 V class) 3 V to 3.6 V
Organization 64M x1 / 32M x2 / 16M x4 8M x 8
Access Time 7 ns —
Package 8-SO Wide (SOP-8 W) 8-pin SOP (SOIC-8, 208-mil)
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: Operating Temperature] -40C to +85C (industrial)
XIP Mode Supported (execute-in-place) —
Program / Erase Suspend Supported —
Hardware / Software Reset Supported —
Packaging Tape & Reel (TR variant) —
RoHS Status [DATA_NEEDED: RoHS Status] Compliant
Lifecycle Status Active —
Memory Capacity — 64 M-bit (8 MB)
Maximum Clock Frequency — 133 MHz
Page Size — 256 bytes
Sector Size — 4 KB
Block Size — 32 KB / 64 KB
Unique ID — 64-bit
Security Features — Individual block lock-down, hardware/software write protection
Standards Support — JEDEC SFDP
Deep Power-Down Mode — Yes (microamp standby current)

Datasheets & Resources

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