P1012NSE2HFB vs P1012NSE2FFB Comparison
Detailed side-by-side comparison of P1012NSE2HFB by NXP Semiconductors and P1012NSE2FFB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
P1012NSE2FFB - QorIQ P1012 800MHz SoC | NXP | Networking
P1012NSE2FFB ✗ End of LifeSpecification Comparison
| Parameter | P1012NSE2HFB | P1012NSE2FFB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | End of Life |
| Processor Series | QorIQ P1 | — |
| Processor Core | PowerPC e500v2 | — |
| Number of Cores | 1 | — |
| Core Architecture | 32-Bit Power Architecture | — |
| Maximum Core Frequency | 800 MHz | 800 MHz |
| Process Technology | 45 nm CMOS | 45 nm |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | Integrated GbE (multiple MACs) | Gigabit Ethernet (GbE) |
| PCIe Controllers | PCIe Gen 2 (x1/x2/x4) | — |
| USB | USB 2.0 (host + device) | Yes (integrated) |
| TDM Interfaces | 4 (T1/E1) | — |
| QUICC Engine (QE) | Yes (protocol offload) | — |
| SEC Security Accelerator | SEC 4.0 | — |
| Package | 689-TEPBGA II (31x31 mm) with exposed thermal pad | 689-TEPBGA II (31x31 mm) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Tj) | 0C to +125C | — |
| RoHS Status | RoHS Compliant | RoHS Compliant |
| Lead Free Status | Lead Free | Lead Free |
| Packaging | Tray | Tray |
| Processor Type | — | PowerPC e500v2 (QorIQ P1) |
| Core Count | — | 1 |
| Data Bus Width | — | 32-bit |
| Operating Temperature | — | 0C to +125C |
| Silicon Revision | — | 1.1 |
| PCIe | — | Yes (integrated) |
| TDM | — | Yes (via QUICC Engine) |
| Security Engine | — | SEC 4.x |