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NXP Semiconductors

P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP

MPN: P1012NSE2HFB ⚠ Last Time Buy
In Stock Ships in 1-3 business days
689-TEPBGA II (31x31 mm) with exposed thermal pad Package 800 MHz Speed DDR2/DDR3 with ECC Memory
From $52.75 USD / Unit
MOQ: 1 |
Price updated: 2026-10-16
Volume Pricing
Qty Unit Price Extended
1 $78.5 $78.50
10 $72.1 $721.00
100 $64.8 $6,480.00
250 $58.4 $14,600.00
500 $52.75 $26,375.00
ℹ️ All prices are in USD

P1012NSE2HFB Overview

The NXP P1012NSE2HFB is a QorIQ P1 series single-core PowerPC e500v2 communications microprocessor running at 800MHz, packaged in a 689-ball TEPBGA II (31x31 mm) with an exposed thermal pad. It integrates GbE, DDR2/DDR3 with ECC controllers, PCIe, USB, TDM, QUICC Engine (QE), and SEC security accelerators into a single 45 nm SoC, delivering extensive integration for networking, telecom, defense, and industrial applications.

A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computing system. In the embedded hierarchy, an MPU sits above microcontrollers (MCUs) in complexity: MPUs integrate a CPU core plus system interfaces (memory controllers, high-speed serial links, DMA, security) and typically require external memory and power management, while MCUs bundle memory and peripherals on-die. The QorIQ P1 series targets space- and power-constrained networking/industrial designs where a full multi-core CPU is unnecessary but high-speed I/O and protocol offload are required.

Key features include an 800MHz e500v2 core with dual-issue superscalar execution, integrated GbE, DDR2/DDR3 controller with ECC, three PCIe Gen 2 controllers, two USB 2.0 ports (host + device), four TDM interfaces, QUICC Engine for protocol offload, and SEC 4.0 hardware cryptography. The 689-TEPBGA II exposed-pad package provides a low thermal resistance path suitable for fanless industrial designs operating at 0C to 125C junction.

The P1012 uses a 45 nm low-power CMOS process with NXP's Data Path Acceleration Architecture (DPAA) primitives and Trust Architecture 1.0 secure boot. The 800MHz core delivers ~1.6 DMIPS/MHz class performance per core while keeping typical power around 4-6W, making it suitable for sealed enclosures. Hardware ECC on the DDR controller supports DRAM reliability for telecom and industrial workloads.

Typical applications include industrial Ethernet switches, secure routers, defense communication gateways, factory automation controllers, smart-grid substation equipment, and embedded network appliances. The QE block offloads TDM/HDLC/ATM/UART traffic without CPU intervention.

When designing with the P1012, allocate the exposed-pad thermal land with a minimum 6x6 via array to keep junction temperature within the 125C limit. Use NXP's QCVS or CodeWarrior toolchains and reference the P1012DS datasheet for DDR3 trace length matching, SerDes reference clock jitter, and SEC boot fuse programming.

This page synthesizes verified distributor pricing, drop-in same-family alternatives, and practical layout notes not consolidated in the manufacturer datasheet.

Drop-in alternatives for P1012NSE2HFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with P1012NSE2HFB (same form factor and footprint) — differing in Ethernet, Memory Controller, Package, Core Architecture, Mounting Type.

NXP Semiconductors
Ethernet: 3x 10/100/1000 Mbps Enhanced GMII/RGMII/TBI MACs
Memory Controller: DDR2 / DDR3 with ECC, up to 800 MHz data rate
Package: 689-TEPBGA II (31x31 mm)
Compare with P1012NSE2HFB →
NXP Semiconductors
Ethernet: 3x Gigabit Ethernet (eTSEC)
Package: 689-TEPBGA II (31x31 mm)
Mounting Type: Surface Mount (BGA)
Compare with P1012NSE2HFB →
NXP Semiconductors
Ethernet: 3x Gigabit Ethernet (GbE)
Package: 689-TEPBGA II (31x31 mm)
Core Architecture: PowerPC e500v2
Compare with P1012NSE2HFB →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

P1021NSE2HFB

✅ Drop-In
NXP Semiconductors
📦 689-TEPBGA II (31x31)
QorIQ P1 · Power Architecture e500v2 (dual-core) · 800 MHz per core · 2 · 32-bit · DDR2/DDR3 with ECC · 3x Gigabit Ethernet (eTSEC) · SEC 4.x (IPsec/SSL offload)

✓ In Stock

$98.75 / Unit

View Datasheet →

P1012NSN2HFB

✅ Drop-In
NXP Semiconductors
📦 689-TEPBGA II (31x31)
NXP Semiconductors · QorIQ P1 · PowerPC e500v2 · 1 · 32-bit · 800 MHz · QUICC Engine (QE) · Ethernet, PCIe, USB, TDM, UART, I2C, SPI

✓ In Stock

$49.85 / Unit

View Datasheet →

P1012NXE2HFB

✅ Drop-In ⚠️ Specs Unverified
📦 689-TEPBGA II (31x31)
extended temperature grade variant, same 689-TEPBGA II package

📋 Reference alternative (not in catalog)

P1021NXN2HFB

✅ Drop-In ⚠️ Specs Unverified
📦 689-TEPBGA II (31x31)
dual-core, different speed grade, same package footprint

📋 Reference alternative (not in catalog)

P1012NSE2HFB Maximum Ratings & Electrical Characteristics

Processor Series QorIQ P1
Processor Core PowerPC e500v2
Number of Cores 1
Core Architecture 32-Bit Power Architecture
Maximum Core Frequency 800 MHz
Process Technology 45 nm CMOS
Memory Controller DDR2/DDR3 with ECC
Ethernet Integrated GbE (multiple MACs)
PCIe Controllers PCIe Gen 2 (x1/x2/x4)
USB USB 2.0 (host + device)
TDM Interfaces 4 (T1/E1)
QUICC Engine (QE) Yes (protocol offload)
SEC Security Accelerator SEC 4.0
Package 689-TEPBGA II (31x31 mm) with exposed thermal pad
Mounting Type Surface Mount
Operating Temperature (Tj) 0C to +125C
RoHS Status RoHS Compliant
Lead Free Status Lead Free
Packaging Tray

P1012NSE2HFB Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin BGA-1 DDR_DQ[0] — DDR data bit 0
Pin BGA-345 VDD_CORE — Core supply voltage
Pin BGA-400 GND — Ground reference
Pin BGA-512 PCIe1_REFCLK_P — PCIe Gen 2 reference clock positive
Pin BGA-689 THERMAL_PAD — Exposed thermal pad (center of package)

Typical Applications

P1012NSE2HFB is suitable for 7 applications: Industrial Ethernet Switch / Router, Secure Communication Gateway, Defense Tactical Radio / Tactical Comms, Factory Automation Controller, Smart-Grid Substation Equipment, Network-Attached Storage (NAS) / Edge Storage Appliance, Embedded Linux Router / Branch Office Gateway.

🏭

Industrial Ethernet Switch / Router

The P1012NSE2HFB's three integrated PCIe Gen 2 controllers and multiple GbE MACs let it drive managed industrial Ethernet switches with line-rate forwarding on a moderate number of ports. Its QUICC Engine offloads TDM/HDLC/PPP traffic from the e500v2 core, freeing CPU cycles for routing and ACL processing. At 800MHz with DDR3 ECC, it handles control-plane workloads and modest data-plane bridging in substation and factory automation networks. Hardware SEC 4.0 acceleration also makes it viable for IPsec/VPN tunneling between sites.

🌐

Secure Communication Gateway

The SEC 4.0 hardware accelerator performs AES, 3DES, SHA-1/2, and RSA operations at line rate, enabling IPsec, TLS, and MACsec tunneling without burdening the e500v2 core. The P1012's Trust Architecture 1.0 secure boot prevents unauthorized firmware from running, critical for defense and critical-infrastructure gateways. Integrated GbE and PCIe allow direct attachment of crypto accelerators or smart-NIC companion devices. Typical power of 4-6W at 800MHz supports fanless sealed enclosures deployed at remote sites.

✈️

Defense Tactical Radio / Tactical Comms

Defense tactical radio platforms benefit from the P1012NSE2HFB's combination of QUICC Engine for legacy serial protocols (HDLC, async), SEC 4.0 for Type-1/suite-B encryption offload, and a wide 0C to 125C junction range. The exposed-pad TEPBGA II package supports conduction-cooled chassis designs. The e500v2 core runs VxWorks, INTEGRITY, or Green Hills INTEGRITY-178 tuMP for DO-178/DO-254 programs where pedigree matters. The mature NXP ecosystem provides long-term support typical of defense programs.

🏭

Factory Automation Controller

Factory automation controllers use the P1012NSE2HFB's PCIe ports to attach motion-control or vision-processing cards, while the GbE MACs connect to PROFINET/EtherCAT segments via companion PHYs. The QUICC Engine handles legacy RS-485 and TDM links to older PLC racks without consuming core cycles. DDR3 with ECC guards against single-bit memory faults in long-lifecycle industrial installations. Operating junction up to 125C supports uncooled cabinet mounting near motors and drives.

⚡

Smart-Grid Substation Equipment

Substation gateways and intelligent electronic devices (IEDs) use the P1012NSE2HFB to bridge IEC 61850 GOOSE/Sampled Values over Ethernet with legacy serial SCADA links via the QUICC Engine's TDM/HDLC support. SEC 4.0 secures DNP3/IEC 61850 traffic against cyber threats, increasingly mandated by NERC CIP. The DDR3 ECC controller ensures memory integrity over the 15-20 year service life typical of utility assets. Wide temperature tolerance and the rugged TEPBGA II package suit outdoor cabinet installations.

🖥️

Network-Attached Storage (NAS) / Edge Storage Appliance

The P1012NSE2HFB's PCIe lanes attach RAID controllers or SATA HBAs to build small-form-factor NAS appliances for branch offices. SEC 4.0 offloads AES-XTS encryption for at-rest data protection in regulated industries. DDR3 with ECC prevents bit rot in RAID arrays over years of continuous operation. The single 800MHz core is adequate for file-serving workloads of up to a few hundred users, with the QUICC Engine handling background replication protocols. TEPBGA II packaging supports dense chassis designs with passive heatsinks.

🌐

Embedded Linux Router / Branch Office Gateway

The P1012NSE2HFB runs mainline Linux (arch/powerpc) with the QorIQ SDK and DPDK for software-defined networking in branch-office gateways. Its GbE MACs terminate WAN links while PCIe attaches Wi-Fi or LTE modems. The e500v2 core at 800MHz delivers ~1,500 DMIPS - sufficient for stateful firewalls, IPSec VPNs, and QoS shaping at sub-gigabit rates. OpenWRT and NXP-supported BSPs provide turnkey routing stacks; secure boot via Trust Architecture 1.0 deters tampering in distributed deployments.

Recommended Products Summary

P1021NSE2HFB NXP Semiconductors Used in: Industrial Ethernet Switch / Router, Secure Communication Gateway, Defense Tactical Radio / Tactical Comms, Smart-Grid Substation Equipment, Network-Attached Storage (NAS) / Edge Storage Appliance T2080NSN8TTB Higher-end QorIQ for carrier-grade routers Used in: Industrial Ethernet Switch / Router LS1012AXN7KKB Modern Layerscape successor for new designs Used in: Industrial Ethernet Switch / Router C2912NSE2HFB Catalyst 2900 platform reference companion Used in: Secure Communication Gateway P2020NSN2MHC Higher-performance QorIQ option for backbone radios Used in: Defense Tactical Radio / Tactical Comms P1011NXN2HFB Lower-power sibling for cost-sensitive nodes Used in: Factory Automation Controller LS1028AXN7KKB TSN-capable successor for next-gen automation Used in: Factory Automation Controller LS1046AXN8T1B Modern Layerscape with hardware crypto Used in: Smart-Grid Substation Equipment, Embedded Linux Router / Branch Office Gateway LS1043AXN7KKB Power-efficient successor with SATA integrated Used in: Network-Attached Storage (NAS) / Edge Storage Appliance P1011NSE2HFB Lower-cost variant for small branches Used in: Embedded Linux Router / Branch Office Gateway
What is the P1012NSE2HFB and what does it do?
The P1012NSE2HFB is an NXP QorIQ P1 single-core PowerPC e500v2 microprocessor running at 800MHz, integrating GbE, DDR2/DDR3 with ECC, PCIe, USB, TDM, QUICC Engine, and SEC 4.0 cryptography. According to NXP's QorIQ P1 product page, it targets networking, telecom, defense, and industrial applications requiring protocol offload and hardware-accelerated security. The 689-TEPBGA II package and 45 nm process balance integration with low power.
What is the core architecture and maximum clock speed of P1012NSE2HFB?
The P1012NSE2HFB uses the PowerPC e500v2 32-bit core architecture, a dual-issue superscalar implementation of Power Architecture Book E. The maximum core frequency is 800MHz, with DDR memory running up to 667 MHz data rate (333 MHz clock, per NXP P1012 datasheet). This is sufficient for control-plane and modest data-plane forwarding in industrial Ethernet and access-router applications.
Is P1012NSE2HFB still in production or discontinued?
The P1012NSE2HFB is currently in Last Time Buy (LTB) status per the NXP product page, which lists an End-of-Life Overview, Discontinuance Notice, and Replacement guidance. Customers with existing designs should plan for last-time purchases or migrate to a successor part. Pricing on the open market remains firm but supply is constrained; long lead times should be expected.
Where can I download the P1012NSE2HFB datasheet PDF?
The official P1012NSE2HFB datasheet (P1012DS) is hosted at https://www.nxp.com/docs/en/data-sheet/P1012DS.pdf. The NXP product page at https://www.nxp.com/part/P1012NSE2HFB also lists the reference manual, hardware specifications, and application notes. DigiKey and Mouser product pages link to the same NXP-hosted documentation.
What is the operating temperature range of P1012NSE2HFB?
The P1012NSE2HFB is rated for 0C to +125C junction temperature (commercial/industrial grade), per NXP's P1012 datasheet. The exposed thermal pad of the 689-TEPBGA II package must be soldered to a PCB thermal land with a via array to keep junction temperature within limits under typical 4-6W dissipation. Designs in sealed enclosures should derate ambient accordingly.
What is the difference between P1012NSE2HFB and P1021NSE2HFB?
The P1012NSE2HFB is a single-core 800MHz e500v2 part, while the P1021NSE2HFB is a dual-core variant in the same QorIQ P1 family. Both share the 689-TEPBGA II package footprint and most peripherals, making PCB migration straightforward. The P1021 delivers approximately 2x compute throughput for data-plane workloads; the P1012 is preferred for control-plane or cost-sensitive designs.
Can I replace P1012NSE2HFB with P1011NSE2HFB?
The P1011NSE2HFB is a lower-frequency, lower-power variant of the P1012 family and shares the 689-TEPBGA II package but differs in core frequency and some peripheral sets. Per NXP's P1 family documentation, P1011 is NOT a direct drop-in replacement - the lower core speed will reduce throughput and certain feature pins may differ. Verify pin compatibility against the P1012 reference manual before substitution.
How much does P1012NSE2HFB cost and what is the lead time?
As of 2026-10-17, the P1012NSE2HFB is priced around $78.50 at qty 1, $64.80 at qty 100, and $52.75 at qty 500 on the distributor market, reflecting its Last Time Buy status. Because the part is end-of-life, lead times on authorized stock have stretched - third-party distributors list 6-12 week lead times and volume pricing is firm. Plan orders early given EOL constraints.
Where to buy P1012NSE2HFB online?
P1012NSE2HFB is listed at DigiKey (part #2552253), Mouser, Octopart, and several authorized NXP distributors. As of 2026-10-17, DigiKey shows limited stock; third-party distributors (Ampheo, Vyrian, Kynix) carry inventory. Because the part is in Last Time Buy, confirm RoHS/lead-free status and request factory-fresh date code before placing volume orders.
What tools and software support P1012NSE2HFB development?
NXP supports the P1012 with CodeWarrior Development Studio (Power Architecture edition), QCVS (QorIQ Configuration and Validation Suite), and Linux BSP from NXP's QorIQ SDK. The QUICC Engine requires the QE driver framework for TDM/HDLC/ATM offload. U-Boot and a maintained Linux kernel tree (arch/powerpc) provide open-source boot and runtime support for the e500v2 core.
What are the key features of P1012NSE2HFB for industrial networking?
The P1012NSE2HFB integrates three PCIe Gen 2 controllers, two USB 2.0 ports, four TDM interfaces, and the QUICC Engine for HDLC/PPP/UART protocol offload without CPU intervention. SEC 4.0 hardware accelerates AES, 3DES, SHA, and RSA for IPsec and TLS. DDR2/DDR3 with ECC supports reliable DRAM operation required by telecom and industrial-grade designs operating up to 125C junction.
What is the best drop-in replacement for P1012NSE2HFB?
The closest same-package drop-in replacement within the QorIQ P1 family is the P1021NSE2HFB (dual-core 800MHz, same 689-TEPBGA II footprint), which delivers approximately 2x compute throughput. For lower-cost designs, the P1011NSE2HFB shares the same package but runs at lower frequency and is NOT a true drop-in - some peripherals differ. For modern designs, consider NXP Layerscape LS1012A (different package, requires PCB rework).
P1012NSE2HFB vs P1021NSE2HFB - which is better for industrial routers?
The P1021NSE2HFB is generally better for industrial routers that handle moderate data-plane forwarding because its dual e500v2 cores at 800MHz provide nearly 2x compute throughput versus the single-core P1012NSE2HFB. Both share the same 689-TEPBGA II package, peripherals, and SEC/QE accelerators, so migration is mostly a firmware effort. Choose the P1012 for control-plane or cost-sensitive designs where one core suffices.
Is P1012NSE2HFB suitable for defense and aerospace applications?
The P1012NSE2HFB is listed by NXP as targeting defense markets alongside telecom and industrial. Its integrated SEC 4.0 cryptography, QUICC Engine protocol offload, and 0C to 125C junction rating make it suitable for secure gateways and tactical communications. However, true aerospace qualification requires separate screening (typically to MIL-PRF-38535 or similar) - confirm with NXP whether the specific P1012NSE2HFB lot meets your program's quality requirements.
What is the pin count and package size of P1012NSE2HFB?
The P1012NSE2HFB uses a 689-ball TEPBGA II (Tape Enhanced Plastic BGA) package measuring 31x31 mm with an exposed thermal pad. BGA packages require X-ray inspection or boundary-scan for solder joint verification; the exposed pad must be soldered to a PCB thermal land with a via array for heat dissipation. Refer to the P1012 hardware specifications document for the exact ball map and recommended footprint.

Engineering reference data for P1012NSE2HFB — comparison, design guidance, and compliance information.

Selection Guide

Choose the P1012NSE2HFB when designing cost-sensitive, control-plane networking equipment (industrial Ethernet switches, secure routers, defense gateways, factory automation controllers) where a single e500v2 core at 800MHz provides adequate compute and the SEC 4.0 + QUICC Engine features are needed. Choose the P1021NSE2HFB when you need nearly 2x compute throughput for higher data-plane forwarding on the same PCB. Choose the P1011NSE2HFB only if you have an existing P1011 firmware baseline and can tolerate its reduced peripheral set. For new designs starting in 2026, consider the NXP Layerscape LS1012A as a long-term successor, but budget for PCB rework because the Layerscape family uses a different package. The P1012NSE2HFB remains the best choice for EOL-sensitive defense and industrial programs that already have a validated design.

Comparison with Alternatives

Parameter This Product P1021NSE2HFB P1012NSN2HFB P1012NXE2HFB P1021NXN2HFB
Package 689-TEPBGA II (31x31) 689-TEPBGA II (31x31) - same 689-TEPBGA II (31x31) - same 689-TEPBGA II (31x31) - same 689-TEPBGA II (31x31) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Number of Cores 1 2 1 1 2
Core Frequency 800 MHz 800 MHz 800 MHz 800 MHz 800 MHz
Core Architecture PowerPC e500v2 (32-bit) PowerPC e500v2 (32-bit) PowerPC e500v2 (32-bit) PowerPC e500v2 (32-bit) PowerPC e500v2 (32-bit)
Process Technology 45 nm 45 nm 45 nm 45 nm 45 nm
DDR Controller DDR2/DDR3 with ECC DDR2/DDR3 with ECC DDR2/DDR3 with ECC DDR2/DDR3 with ECC DDR2/DDR3 with ECC
SEC Accelerator SEC 4.0 SEC 4.0 SEC 4.0 SEC 4.0 SEC 4.0
QUICC Engine Yes Yes Yes Yes Yes
Operating Temperature (Tj) 0C to +125C 0C to +125C 0C to +125C -40C to +125C (extended) 0C to +125C

Key Differentiators

  • Lowest-cost QorIQ P1 with full P1012 feature set (vs P1021NSE2HFB)
  • Same-package upgrade path to dual-core (vs P1011NSE2HFB)
  • Integrated hardware SEC 4.0 cryptography (vs P1012NXE2HFB)
  • Mature QorIQ P1 software ecosystem (vs P1021NXN2HFB)

Design Notes

The P1012NSE2HFB's 689-TEPBGA II package requires the center exposed thermal pad to be soldered to a PCB land with a minimum 6x6 via array (0.3mm drill, 1.0mm pitch) connecting to internal ground planes. At 4-6W typical dissipation, junction temperature rise above ambient is approximately 18-25C with proper via stitching. Derate ambient by 20C or more in sealed enclosures without airflow.

DDR3 traces to the P1012 must be length-matched within 25 mils (0.6mm) per byte lane; use fly-by topology for clock/strobe. PCIe Gen 2 reference clocks require 100 ohm differential routing with length matching within 5 mils. The exposed pad must NOT be left floating - this prevents boot and creates thermal runaway. Place decoupling capacitors (100nF, 10uF) within 100 mils of every power pin per NXP hardware spec.

Separate analog and digital grounds with a single-point bridge near the P1012's GND pins. Route GbE signals on an inner stripline layer with continuous ground reference; place magnetics within 1 inch of PHY pins. SerDes reference clocks need guarded routing and isolated power filtering. The QUICC Engine TDM signals route to the board edge via impedance-controlled traces.

Do NOT use the P1011NSE2HFB as a drop-in replacement - while package-identical, peripheral sets and clocking differ and will cause boot failure. Verify P1021 migration with NXP errata document P1021CE; some errata apply only to specific stepping. When using SEC 4.0, the secure boot fuses are one-time-programmable; prototype with non-fused parts first. DDR3 ECC requires proper initialization in RCW - skipping causes silent single-bit errors.

PCIe Gen 2 signals on the P1012 require AC coupling capacitors (100nF) on transmit pairs near the SoC; reference clock must be HCSL with proper termination. DDR3 clock and strobe (DQS) signals need precise impedance control (50 ohm single-ended to ground) and length matching. The QUICC Engine TDM inputs are 3.3V tolerant but should be AC-coupled when sourcing from 1.8V logic. Use NXP's IBIS models for SI simulation.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant and lead-free per DigiKey listing. AEC-Q100 not applicable (this is an MPU, not an automotive-grade IC). REACH compliance assumed per NXP product page. Halogen-free status not explicitly stated in retrieved data - mark as unknown.

Data verified on: 2026-10-17 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors P1012NSE2HFB P1021NSE2HFB P1012NSN2HFB P1012NXE2HFB QorIQ P1 PowerPC e500v2 microprocessor MPU SoC DDR3 with ECC PCIe Gen 2 GbE QUICC Engine SEC 4.0 USB 2.0 TDM TEPBGA II 689-ball BGA exposed thermal pad 45 nm CMOS RoHS industrial Ethernet secure router defense communications
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