P1012NSE2HFB vs P1012NSE2FFB Comparación
Comparación detallada lado a lado de P1012NSE2HFB por NXP Semiconductors y P1012NSE2FFB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
P1012NSE2FFB - QorIQ P1012 800MHz SoC | NXP | Networking
P1012NSE2FFB ✗ Fin de vidaComparación de especificaciones
| Parámetro | P1012NSE2HFB | P1012NSE2FFB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Fin de vida |
| Processor Series | QorIQ P1 | — |
| Processor Core | PowerPC e500v2 | — |
| Number of Cores | 1 | — |
| Core Architecture | 32-Bit Power Architecture | — |
| Maximum Core Frequency | 800 MHz | 800 MHz |
| Process Technology | 45 nm CMOS | 45 nm |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | Integrated GbE (multiple MACs) | Gigabit Ethernet (GbE) |
| PCIe Controllers | PCIe Gen 2 (x1/x2/x4) | — |
| USB | USB 2.0 (host + device) | Yes (integrated) |
| TDM Interfaces | 4 (T1/E1) | — |
| QUICC Engine (QE) | Yes (protocol offload) | — |
| SEC Security Accelerator | SEC 4.0 | — |
| Encapsulado | 689-TEPBGA II (31x31 mm) with exposed thermal pad | 689-TEPBGA II (31x31 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Tj) | 0C to +125C | — |
| Estado RoHS | RoHS Compliant | RoHS Compliant |
| Lead Free Status | Lead Free | Lead Free |
| Packaging | Tray | Tray |
| Processor Type | — | PowerPC e500v2 (QorIQ P1) |
| Core Count | — | 1 |
| Ancho del bus de datos | — | 32-bit |
| Temperatura de funcionamiento | — | 0C to +125C |
| Silicon Revision | — | 1.1 |
| PCIe | — | Yes (integrated) |
| TDM | — | Yes (via QUICC Engine) |
| Security Engine | — | SEC 4.x |