S9S08AW60E5MFGE vs MC9S08AW60CPUE Comparison

Detailed side-by-side comparison of S9S08AW60E5MFGE by NXP Semiconductors and MC9S08AW60CPUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ Active
NXP Semiconductors
MC9S08AW60CPUE MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP

MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP

MC9S08AW60CPUE ✓ Active

Specification Comparison

Parameter S9S08AW60E5MFGE MC9S08AW60CPUE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.05 $0.00
Core Architecture HCS08 (S08 enhanced), 8-bit CISC —
CPU Clock (Max) 40 MHz (20 MHz bus) —
Program Flash 60 KB (60K x 8) —
RAM [DATA_NEEDED: RAM size] —
EEPROM / Data Flash [DATA_NEEDED: data EEPROM size] —
Supply Voltage 3 V / 3.3 V / 5 V —
Package 44-pin LQFP (10 x 10 mm) 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height)
I/O Pins [DATA_NEEDED: GPIO count] —
ADC Multi-channel 10-bit (per family) 10-bit
Communication SCI (UART), SPI, I2C —
Timers TPM modules with PWM channels —
Debug Interface BDM (Background Debug Mode) Single-wire background debug mode (BDM)
Operating Temperature -40C to +125C (automotive range) [DATA_NEEDED: Operating Temperature Range]
Mounting Type Surface Mount Surface Mount
Family S08 / MC9S08AW60 series HCS08 (S08AW)
Automotive/Industrial Dual-targeted —
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel) —
Core Processor — S08 (HCS08)
Core Size — 8-Bit
Speed (CPU Clock) — 40 MHz
Internal Bus Frequency — 20 MHz
Flash Memory — 60 KB (60K x 8)
RAM Size — 4 KB
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38
Peripherals — 16-bit timer, ADC, SCI, SPI, multiple power-saving modes
Instruction Set — HC08 (CISC) with added BGND instruction
Life Cycle Stage — Active
Programmable Memory Type — Flash

Datasheets & Resources

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