S9S08AW60E5MFGE vs MC9S08AW60CPUE Vergleich

Detaillierter Direktvergleich von S9S08AW60E5MFGE von NXP Semiconductors und MC9S08AW60CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ Aktiv
NXP Semiconductors
MC9S08AW60CPUE MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP

MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP

MC9S08AW60CPUE ✓ Aktiv

Spezifikationsvergleich

Parameter S9S08AW60E5MFGE MC9S08AW60CPUE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $6,05 $0,00
Core Architecture HCS08 (S08 enhanced), 8-bit CISC —
CPU Clock (Max) 40 MHz (20 MHz bus) —
Program Flash 60 KB (60K x 8) —
RAM [DATA_NEEDED: RAM size] —
EEPROM / Data Flash [DATA_NEEDED: data EEPROM size] —
Versorgungsspannung 3 V / 3.3 V / 5 V —
Gehäuse 44-pin LQFP (10 x 10 mm) 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height)
I/O Pins [DATA_NEEDED: GPIO count] —
ADC Multi-channel 10-bit (per family) 10-bit
Communication SCI (UART), SPI, I2C —
Timers TPM modules with PWM channels —
Debug Interface BDM (Background Debug Mode) Single-wire background debug mode (BDM)
Betriebstemperatur -40C to +125C (automotive range) [DATA_NEEDED: Operating Temperature Range]
Montageart Surface Mount Surface Mount
Family S08 / MC9S08AW60 series HCS08 (S08AW)
Automotive/Industrial Dual-targeted —
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel) —
Core Processor — S08 (HCS08)
Core Size — 8-Bit
Speed (CPU Clock) — 40 MHz
Internal Bus Frequency — 20 MHz
Flash Memory — 60 KB (60K x 8)
RAM Size — 4 KB
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38
Peripherals — 16-bit timer, ADC, SCI, SPI, multiple power-saving modes
Instruction Set — HC08 (CISC) with added BGND instruction
Life Cycle Stage — Active
Programmable Memory Type — Flash

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