S9S08AW60E5MFGE vs MC9S08AW60CPUE 对比

详细并排对比 S9S08AW60E5MFGE 出自 NXP Semiconductors 和 MC9S08AW60CPUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ 量产中
NXP Semiconductors
MC9S08AW60CPUE MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP

MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP

MC9S08AW60CPUE ✓ 量产中

规格对比

参数 S9S08AW60E5MFGE MC9S08AW60CPUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $6.05 $0.00
Core Architecture HCS08 (S08 enhanced), 8-bit CISC —
CPU Clock (Max) 40 MHz (20 MHz bus) —
Program Flash 60 KB (60K x 8) —
RAM [DATA_NEEDED: RAM size] —
EEPROM / Data Flash [DATA_NEEDED: data EEPROM size] —
电源电压 3 V / 3.3 V / 5 V —
封装 44-pin LQFP (10 x 10 mm) 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height)
I/O Pins [DATA_NEEDED: GPIO count] —
ADC Multi-channel 10-bit (per family) 10-bit
Communication SCI (UART), SPI, I2C —
Timers TPM modules with PWM channels —
Debug Interface BDM (Background Debug Mode) Single-wire background debug mode (BDM)
工作温度 -40C to +125C (automotive range) [DATA_NEEDED: Operating Temperature Range]
安装类型 Surface Mount Surface Mount
Family S08 / MC9S08AW60 series HCS08 (S08AW)
Automotive/Industrial Dual-targeted —
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel) —
Core Processor — S08 (HCS08)
Core Size — 8-Bit
Speed (CPU Clock) — 40 MHz
Internal Bus Frequency — 20 MHz
Flash Memory — 60 KB (60K x 8)
RAM Size — 4 KB
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38
Peripherals — 16-bit timer, ADC, SCI, SPI, multiple power-saving modes
Instruction Set — HC08 (CISC) with added BGND instruction
Life Cycle Stage — Active
Programmable Memory Type — Flash

数据手册与资源

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