SPC5746BSK1MKU2 vs SPC5645SF1VVU Comparison
Detailed side-by-side comparison of SPC5746BSK1MKU2 by NXP Semiconductors and SPC5645SF1VVU by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
SPC5746BSK1MKU2 - 120MHz 32-bit Automotive MCU 3MB | NXP
SPC5746BSK1MKU2 ✓ ActiveNXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ ActiveSpecification Comparison
| Parameter | SPC5746BSK1MKU2 | SPC5645SF1VVU |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.25 | $27.10 |
| Core Processor | e200z4 (Power Architecture) | — |
| Core Size | 32-bit | — |
| Number of Cores | 1 (single core) | — |
| Maximum Clock Frequency | 120 MHz | 125 MHz |
| Flash Memory | 3 MB (3M x 8) | — |
| Data RAM Size | 384 kB | — |
| ADC Resolution | 10 bit, 12 bit | — |
| Number of I/Os | 129 I/O | — |
| Supply Voltage (Core) | 1.2 V to 1.32 V | — |
| Data Bus Width | 32 bit | 32-bit |
| Connectivity | FlexRay | — |
| Operating Temperature | -40C to +125C | — |
| Qualification | Automotive Qualified | — |
| Package / Case | LQFP-176 (24x24 mm) | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| Mounting Style | SMD/SMT | — |
| Product Family | MPC574xB/C/G (SPC57xx) | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Core Architecture | — | Power Architecture e200z4d (dual-core lockstep option) |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| Supply Voltage | — | 3.3 V / 5 V tolerant I/O |
| Operating Temperature Range | — | -40 C to +105 C |
| Mounting Type | — | Surface Mount |
| AEC-Q100 Qualification | — | Yes (Automotive Grade) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| Debug Interface | — | JTAG / Nexus 5001 (Level 3 trace) |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |