SPC5746BSK1MKU2 vs SPC5645SF1VVU Vergleich
Detaillierter Direktvergleich von SPC5746BSK1MKU2 von NXP Semiconductors und SPC5645SF1VVU von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ AktivSpezifikationsvergleich
| Parameter | SPC5746BSK1MKU2 | SPC5645SF1VVU |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,25 | $27,10 |
| Core Processor | e200z4 (Power Architecture) | — |
| Core Size | 32-bit | — |
| Number of Cores | 1 (single core) | — |
| Maximale Taktfrequenz | 120 MHz | 125 MHz |
| Flash Memory | 3 MB (3M x 8) | — |
| Data RAM Size | 384 kB | — |
| ADC Resolution | 10 bit, 12 bit | — |
| Number of I/Os | 129 I/O | — |
| Supply Voltage (Core) | 1.2 V to 1.32 V | — |
| Datenbusbreite | 32 bit | 32-bit |
| Connectivity | FlexRay | — |
| Betriebstemperatur | -40C to +125C | — |
| Qualification | Automotive Qualified | — |
| Gehäuse / Bauform | LQFP-176 (24x24 mm) | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| Montagestil | SMD/SMT | — |
| Product Family | MPC574xB/C/G (SPC57xx) | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Core Architecture | — | Power Architecture e200z4d (dual-core lockstep option) |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| Versorgungsspannung | — | 3.3 V / 5 V tolerant I/O |
| Betriebstemperaturbereich | — | -40 C to +105 C |
| Montageart | — | Surface Mount |
| AEC-Q100 Qualification | — | Yes (Automotive Grade) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| Debug Interface | — | JTAG / Nexus 5001 (Level 3 trace) |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |