STM32F746ZGT6 vs STM32F745ZET6 Comparison
Detailed side-by-side comparison of STM32F746ZGT6 by STMicroelectronics and STM32F745ZET6 by STMicroelectronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
STMicroelectronics
STM32F746ZGT6 - 216MHz Cortex-M7 1MB Flash MCU | STMicroelectronics
STM32F746ZGT6 ✓ ActiveSTMicroelectronics
STM32F745ZET6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics
STM32F745ZET6 ✓ ActiveSpecification Comparison
| Parameter | STM32F746ZGT6 | STM32F745ZET6 |
|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Core Architecture | Arm Cortex-M7 (32-bit) | — |
| Maximum Clock Frequency | 216 MHz | — |
| Performance | 462 DMIPS / 1082 CoreMark | — |
| FPU | Single-precision (IEEE 754) | — |
| DSP Instructions | Yes (full DSP instruction set) | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| SRAM | 320 KB | — |
| DTCM | 16 KB | — |
| L1 Cache (I/D) | 6 KB / 6 KB | — |
| Operating Voltage | 1.7 V to 3.6 V | — |
| I/O Voltage | 1.7 V to 3.6 V | — |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20 mm x 20 mm) |
| Operating Temperature | -40 C to +85 C | — |
| ADC | 3 x 12-bit, up to 2.4 MSPS | — |
| DAC | 2 x 12-bit | — |
| Communication Interfaces | USB OTG HS/FS, Ethernet MAC (IEEE 1588), 2x CAN 2.0B, SPDIFRX, SDMMC, UART, SPI, I2C | — |
| LCD-TFT Controller | Yes (up to WXGA resolution, capacitive touch support) | — |
| DMA Channels | 16-stream DMA + Chrom-ART Accelerator (DMA2D) | — |
| Mounting Type | Surface Mount | Surface mount |
| RoHS Status | Compliant | — |
| Core | — | 32-bit ARM Cortex-M7 |
| Maximum Operating Frequency | — | 216 MHz |
| Flash Memory | — | 512 KB (512K x 8) |
| Architecture | — | 32-bit RISC |
| Supply Voltage Options | — | 1.8 V, 2.5 V, and 3.3 V |
| Microcontroller Family | — | STM32F7 |
| Product Type | — | 32-bit microcontroller IC |
| DSP/FPU Positioning | — | High-performance and DSP/FPU |
| Packaging | — | Tray |
| RAM | — | [DATA_NEEDED: RAM memory] |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| Maximum I/O Count | — | [DATA_NEEDED: maximum I/O count] |
| Peripheral Interfaces | — | [DATA_NEEDED: peripheral interfaces] |
| Clock Sources | — | [DATA_NEEDED: clock sources] |
| Flash Endurance | — | [DATA_NEEDED: Flash endurance] |
| ESD/Humidity Qualification | — | [DATA_NEEDED: ESD and humidity qualification] |
| RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |