STM32F746ZGT6 vs STM32F745ZET6 Perbandingan
Perbandingan bersamaan detil STM32F746ZGT6 dari STMicroelectronics dan STM32F745ZET6 dari STMicroelectronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
STMicroelectronics
STM32F746ZGT6 - 216MHz Cortex-M7 1MB Flash MCU | STMicroelectronics
STM32F746ZGT6 ✓ AktifSTMicroelectronics
STM32F745ZET6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics
STM32F745ZET6 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | STM32F746ZGT6 | STM32F745ZET6 |
|---|---|---|
| Merek | STMicroelectronics | STMicroelectronics |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Architecture | Arm Cortex-M7 (32-bit) | — |
| Frekuensi Bawah Maximum | 216 MHz | — |
| Performance | 462 DMIPS / 1082 CoreMark | — |
| FPU | Single-precision (IEEE 754) | — |
| DSP Instructions | Yes (full DSP instruction set) | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| SRAM | 320 KB | — |
| DTCM | 16 KB | — |
| L1 Cache (I/D) | 6 KB / 6 KB | — |
| Operating Voltage | 1.7 V to 3.6 V | — |
| I/O Voltage | 1.7 V to 3.6 V | — |
| Paket | 144-LQFP (20x20 mm) | 144-LQFP (20 mm x 20 mm) |
| Suhu Kerja | -40 C to +85 C | — |
| ADC | 3 x 12-bit, up to 2.4 MSPS | — |
| DAC | 2 x 12-bit | — |
| Communication Interfaces | USB OTG HS/FS, Ethernet MAC (IEEE 1588), 2x CAN 2.0B, SPDIFRX, SDMMC, UART, SPI, I2C | — |
| LCD-TFT Controller | Yes (up to WXGA resolution, capacitive touch support) | — |
| DMA Channels | 16-stream DMA + Chrom-ART Accelerator (DMA2D) | — |
| Tipe Mounting | Surface Mount | Surface mount |
| Status RoHS | Compliant | — |
| Core | — | 32-bit ARM Cortex-M7 |
| Maximum Operating Frequency | — | 216 MHz |
| Flash Memory | — | 512 KB (512K x 8) |
| Architecture | — | 32-bit RISC |
| Supply Voltage Options | — | 1.8 V, 2.5 V, and 3.3 V |
| Microcontroller Family | — | STM32F7 |
| Product Type | — | 32-bit microcontroller IC |
| DSP/FPU Positioning | — | High-performance and DSP/FPU |
| Packaging | — | Tray |
| RAM | — | [DATA_NEEDED: RAM memory] |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Maximum I/O Count | — | [DATA_NEEDED: maximum I/O count] |
| Peripheral Interfaces | — | [DATA_NEEDED: peripheral interfaces] |
| Clock Sources | — | [DATA_NEEDED: clock sources] |
| Flash Endurance | — | [DATA_NEEDED: Flash endurance] |
| ESD/Humidity Qualification | — | [DATA_NEEDED: ESD and humidity qualification] |
| RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |