STM32F746ZGT6 vs STM32F745ZET6 Сравнение
Подробное сравнение бок о бок STM32F746ZGT6 от STMicroelectronics и STM32F745ZET6 от STMicroelectronics. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
STMicroelectronics
STM32F746ZGT6 - 216MHz Cortex-M7 1MB Flash MCU | STMicroelectronics
STM32F746ZGT6 ✓ АктивенSTMicroelectronics
STM32F745ZET6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics
STM32F745ZET6 ✓ АктивенСравнение характеристик
| Параметр | STM32F746ZGT6 | STM32F745ZET6 |
|---|---|---|
| Бренд | STMicroelectronics | STMicroelectronics |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Активен | Активен |
| Core Architecture | Arm Cortex-M7 (32-bit) | — |
| Максимальная тактовая частота | 216 MHz | — |
| Performance | 462 DMIPS / 1082 CoreMark | — |
| FPU | Single-precision (IEEE 754) | — |
| DSP Instructions | Yes (full DSP instruction set) | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| SRAM | 320 KB | — |
| DTCM | 16 KB | — |
| L1 Cache (I/D) | 6 KB / 6 KB | — |
| Operating Voltage | 1.7 V to 3.6 V | — |
| I/O Voltage | 1.7 V to 3.6 V | — |
| Корпус | 144-LQFP (20x20 mm) | 144-LQFP (20 mm x 20 mm) |
| Рабочая температура | -40 C to +85 C | — |
| ADC | 3 x 12-bit, up to 2.4 MSPS | — |
| DAC | 2 x 12-bit | — |
| Communication Interfaces | USB OTG HS/FS, Ethernet MAC (IEEE 1588), 2x CAN 2.0B, SPDIFRX, SDMMC, UART, SPI, I2C | — |
| LCD-TFT Controller | Yes (up to WXGA resolution, capacitive touch support) | — |
| DMA Channels | 16-stream DMA + Chrom-ART Accelerator (DMA2D) | — |
| Тип монтажа | Surface Mount | Surface mount |
| Статус RoHS | Compliant | — |
| Core | — | 32-bit ARM Cortex-M7 |
| Maximum Operating Frequency | — | 216 MHz |
| Flash Memory | — | 512 KB (512K x 8) |
| Architecture | — | 32-bit RISC |
| Supply Voltage Options | — | 1.8 V, 2.5 V, and 3.3 V |
| Microcontroller Family | — | STM32F7 |
| Product Type | — | 32-bit microcontroller IC |
| DSP/FPU Positioning | — | High-performance and DSP/FPU |
| Packaging | — | Tray |
| RAM | — | [DATA_NEEDED: RAM memory] |
| Диапазон рабочих температур | — | [DATA_NEEDED: operating temperature range] |
| Maximum I/O Count | — | [DATA_NEEDED: maximum I/O count] |
| Peripheral Interfaces | — | [DATA_NEEDED: peripheral interfaces] |
| Clock Sources | — | [DATA_NEEDED: clock sources] |
| Flash Endurance | — | [DATA_NEEDED: Flash endurance] |
| ESD/Humidity Qualification | — | [DATA_NEEDED: ESD and humidity qualification] |
| RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |