XC6SLX100-3FGG484C vs XC6SLX75-3FGG484C Comparison

Detailed side-by-side comparison of XC6SLX100-3FGG484C by AMD and XC6SLX75-3FGG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX100-3FGG484C XC6SLX75-3FGG484C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Spartan-6 LX —
Logic Cells 101,261 74,637
System Gates 4,939,776 —
User I/O 326 —
Block RAM 4,824 Kbits (4824 Kb = ~4824 Kbits total Block RAM) [DATA_NEEDED: block RAM capacity]
DSP48A1 Slices 180 —
Speed Grade -3 (highest performance) -3 (highest performance in Spartan-6 LX family)
Process Node 45 nm CMOS —
Core Voltage (VCCINT) 1.2 V (nominal) —
Package 484-ball FBG (FGG484), 19 x 19 mm, 0.80 mm pitch, Pb-free —
Operating Temperature 0 C to +85 C (C grade, commercial) —
Internal/Max Frequency 667 MHz (memory controller; logic Fmax speed-grade dependent) —
Mounting Type Surface Mount (BGA) Surface Mount (SMD)
RoHS Status Compliant unknown
Lead-Free Status Lead Free —
Device Type — Field Programmable Gate Array (FPGA)
Series — Spartan-6 LX
User I/O Count — 280
Package Type — 484-ball FBGA (MS-034)
Package Body Size — 23 x 23 mm
Package Pitch — 1.0 mm
Internal Clock Frequency — 667 MHz
Operating Temperature Range — 0 °C to 85 °C (commercial grade)
Supply Voltage — [DATA_NEEDED: supply voltage range]
DSP Slices — [DATA_NEEDED: DSP48A slice count]
Configuration Memory — [DATA_NEEDED: configuration memory type]
I/O Standards — [DATA_NEEDED: supported I/O standards per bank]
Manufacturer — AMD (formerly Xilinx)
Order Code Suffix — C = commercial temperature grade

Datasheets & Resources

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