XC6SLX100-3FGG484C vs XC6SLX75-3FGG484C 对比

详细并排对比 XC6SLX100-3FGG484C 出自 AMD 和 XC6SLX75-3FGG484C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX100-3FGG484C XC6SLX75-3FGG484C
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Family Spartan-6 LX —
Logic Cells 101,261 74,637
System Gates 4,939,776 —
User I/O 326 —
Block RAM 4,824 Kbits (4824 Kb = ~4824 Kbits total Block RAM) [DATA_NEEDED: block RAM capacity]
DSP48A1 Slices 180 —
Speed Grade -3 (highest performance) -3 (highest performance in Spartan-6 LX family)
Process Node 45 nm CMOS —
Core Voltage (VCCINT) 1.2 V (nominal) —
封装 484-ball FBG (FGG484), 19 x 19 mm, 0.80 mm pitch, Pb-free —
工作温度 0 C to +85 C (C grade, commercial) —
Internal/Max Frequency 667 MHz (memory controller; logic Fmax speed-grade dependent) —
安装类型 Surface Mount (BGA) Surface Mount (SMD)
RoHS 状态 Compliant unknown
Lead-Free Status Lead Free —
Device Type — Field Programmable Gate Array (FPGA)
Series — Spartan-6 LX
User I/O Count — 280
Package Type — 484-ball FBGA (MS-034)
Package Body Size — 23 x 23 mm
Package Pitch — 1.0 mm
Internal Clock Frequency — 667 MHz
工作温度范围 — 0 °C to 85 °C (commercial grade)
电源电压 — [DATA_NEEDED: supply voltage range]
DSP Slices — [DATA_NEEDED: DSP48A slice count]
Configuration Memory — [DATA_NEEDED: configuration memory type]
I/O Standards — [DATA_NEEDED: supported I/O standards per bank]
Manufacturer — AMD (formerly Xilinx)
Order Code Suffix — C = commercial temperature grade

数据手册与资源

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