XC6SLX75-3FG484I vs XC6SLX75-3FGG484C Comparison

Detailed side-by-side comparison of XC6SLX75-3FG484I by AMD and XC6SLX75-3FGG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX75-3FG484I XC6SLX75-3FGG484C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Active
Device Type FPGA Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX —
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
Process Technology 45 nm CMOS —
Supply Voltage 1.2 V [DATA_NEEDED: supply voltage range]
User I/O 280 I/O —
Internal Frequency 667 MHz —
Catalog Maximum Frequency 862 MHz —
Speed Grade -3 highest-performance family grade -3 (highest performance in Spartan-6 LX family)
Temperature Grade Industrial —
Operating Temperature 0°C to 85°C (32°F to 185°F) —
Package FBGA-484 —
Package Dimensions 23 mm × 23 mm —
Package Pitch 1 mm 1.0 mm
Terminal Count 484 balls —
Mounting Type Surface mount Surface Mount (SMD)
RoHS Status [DATA_NEEDED: RoHS status] unknown
REACH Status [DATA_NEEDED: REACH status] —
Series — Spartan-6 LX
User I/O Count — 280
Package Type — 484-ball FBGA (MS-034)
Package Body Size — 23 x 23 mm
Internal Clock Frequency — 667 MHz
Operating Temperature Range — 0 °C to 85 °C (commercial grade)
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Slices — [DATA_NEEDED: DSP48A slice count]
Configuration Memory — [DATA_NEEDED: configuration memory type]
I/O Standards — [DATA_NEEDED: supported I/O standards per bank]
Manufacturer — AMD (formerly Xilinx)
Order Code Suffix — C = commercial temperature grade

Datasheets & Resources

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