XC6SLX75-3FG484I vs XC6SLX75-3FGG484C Vergleich
Detaillierter Direktvergleich von XC6SLX75-3FG484I von AMD und XC6SLX75-3FGG484C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX75-3FG484I | XC6SLX75-3FGG484C |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Unknown | Aktiv |
| Device Type | FPGA | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 74,637 cells | 74,637 |
| Configurable Logic Blocks | 5,831 CLBs | — |
| Process Technology | 45 nm CMOS | — |
| Versorgungsspannung | 1.2 V | [DATA_NEEDED: supply voltage range] |
| User I/O | 280 I/O | — |
| Internal Frequency | 667 MHz | — |
| Catalog Maximum Frequency | 862 MHz | — |
| Speed Grade | -3 highest-performance family grade | -3 (highest performance in Spartan-6 LX family) |
| Temperature Grade | Industrial | — |
| Betriebstemperatur | 0°C to 85°C (32°F to 185°F) | — |
| Gehäuse | FBGA-484 | — |
| Package Dimensions | 23 mm × 23 mm | — |
| Package Pitch | 1 mm | 1.0 mm |
| Terminal Count | 484 balls | — |
| Montageart | Surface mount | Surface Mount (SMD) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | unknown |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Series | — | Spartan-6 LX |
| User I/O Count | — | 280 |
| Package Type | — | 484-ball FBGA (MS-034) |
| Package Body Size | — | 23 x 23 mm |
| Internal Clock Frequency | — | 667 MHz |
| Betriebstemperaturbereich | — | 0 °C to 85 °C (commercial grade) |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slices | — | [DATA_NEEDED: DSP48A slice count] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards per bank] |
| Manufacturer | — | AMD (formerly Xilinx) |
| Order Code Suffix | — | C = commercial temperature grade |