XC6SLX75-3FG484I vs XC6SLX75-3FGG484C 对比
详细并排对比 XC6SLX75-3FG484I 出自 AMD 和 XC6SLX75-3FGG484C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX75-3FG484I | XC6SLX75-3FGG484C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Unknown | 有效 |
| Device Type | FPGA | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 74,637 cells | 74,637 |
| Configurable Logic Blocks | 5,831 CLBs | — |
| Process Technology | 45 nm CMOS | — |
| 电源电压 | 1.2 V | [DATA_NEEDED: supply voltage range] |
| User I/O | 280 I/O | — |
| Internal Frequency | 667 MHz | — |
| Catalog Maximum Frequency | 862 MHz | — |
| Speed Grade | -3 highest-performance family grade | -3 (highest performance in Spartan-6 LX family) |
| Temperature Grade | Industrial | — |
| 工作温度 | 0°C to 85°C (32°F to 185°F) | — |
| 封装 | FBGA-484 | — |
| Package Dimensions | 23 mm × 23 mm | — |
| Package Pitch | 1 mm | 1.0 mm |
| Terminal Count | 484 balls | — |
| 安装类型 | Surface mount | Surface Mount (SMD) |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | unknown |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Series | — | Spartan-6 LX |
| User I/O Count | — | 280 |
| Package Type | — | 484-ball FBGA (MS-034) |
| Package Body Size | — | 23 x 23 mm |
| Internal Clock Frequency | — | 667 MHz |
| 工作温度范围 | — | 0 °C to 85 °C (commercial grade) |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slices | — | [DATA_NEEDED: DSP48A slice count] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards per bank] |
| Manufacturer | — | AMD (formerly Xilinx) |
| Order Code Suffix | — | C = commercial temperature grade |