XC7A75T-2FT256I
XC7A75T-2FT256I - 75K Logic Cell Artix-7 FPGA | AMD
The AMD XC7A75T-2FT256I is an Artix-7 field-programmable gate array with 3,870,720 RAM bits, a -2 performance grade, and an industrial temperature designation in a 256-FTBGA package. The supplied data identifies a 17 x 17 mm package and tray packaging, making it a high-density programmable logic option for embedded control, signal processing, communications, and industrial automation systems. Its exact logic-cell count, I/O count, voltage ratings, and timing figures are not stated in the verified snippets and therefore remain marked as data needed.
An FPGA is a semiconductor device whose programmable logic, memory, and I/O resources can be configured after manufacture. Artix-7 belongs to the AMD/Xilinx FPGA product hierarchy and uses a 28 nm process platform, as described on the verified AMD Artix-7 product page. Within the broader category of programmable logic devices, the XC7A75T family is positioned between smaller control-oriented devices and larger communications or processing devices. The XC7A75T-2FT256I combines a 3,870,720-bit memory resource with a compact 256-ball package for designs requiring substantial configurable logic in a relatively small board area.
The verified listing supplies the product identity as an Artix-7 FPGA IC with 170, 3,870,720, 75,520, and 256-LBGA attributes, while the detailed product result describes a 256-FTBGA package. These numbers should not be conflated without the manufacturer pinout and device-selection documentation. The -2 suffix denotes the requested speed grade in the ordering nomenclature, but the verified material does not provide operating frequencies or timing margins. The exact performance grade limits, I/O standards, block RAM organization, DSP resources, configuration interface, and power characteristics require manufacturer datasheet verification before schematic capture or timing closure.
This device is suitable for industrial control logic, sensor acquisition, motor-control interfaces, low- and medium-speed communications, test equipment, and embedded instrumentation. A design team can use programmable fabric for parallel interfaces, state machines, protocol handling, and control paths while using block RAM for buffering and DSP slices for selected arithmetic operations. The industrial temperature result covers -40°C to 100°C junction temperature according to the supplied distributor data, but temperature behavior still depends on the final system power dissipation, airflow, board construction, and selected FPGA grade.
For implementation, preserve the exact 256-FTBGA land pattern, ball assignments, power rails, decoupling requirements, configuration pins, and I/O-bank constraints defined by AMD. Do not substitute a visually similar 256-ball package without checking the official package files and UG475 pinout documentation. Configuration storage, startup behavior, clocking, JTAG access, and bitstream generation should be validated in AMD Vivado or another explicitly supported FPGA toolchain. A common engineering pitfall is treating a distributor similarity result as proof of interchangeability; FPGA replacement requires exact package, pin, speed, temperature, resource, and bitstream compatibility.
This page consolidates the verified distributor identity, package information, public AMD family description, package-pinout references, and practical selection considerations. It distinguishes confirmed data from parameters that require confirmation, helping engineers evaluate sourcing, footprint matching, and migration risk before committing to a 256-FTBGA FPGA layout.
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