10AX115N2F40E1SG vs 10AX115N3F40E2SG Vergleich
Detaillierter Direktvergleich von 10AX115N2F40E1SG von Intel und 10AX115N3F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115N2F40E1SG | 10AX115N3F40E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.325,00 | $5.450,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,600 | — |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Variable-precision DSP |
| Maximum User I/O Pins | 600 | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | 600 |
| Maximum Transceiver Data Rate | 17.4 Gbps (chip-to-chip) | 17.4 Gbps |
| Hard PCIe IP Blocks | PCIe Gen3 | — |
| Process Technology | 20 nm | TSMC 20 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Gehäuse | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA (F40) |
| Package Dimensions | 40 mm x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | N2 | — |
| Temperature Grade | E1 (commercial) | — |
| Betriebs-Sperrschichttemperatur | -40C to +100C | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory | — | 68,857,856 bits (approximately 68.85 Mbit) |
| Hard Memory Controllers | — | Yes (DDR4 support) |
| PCIe Hard IP | — | PCIe Gen3 (hard IP) |
| Package Code | — | BGA / FCBGA |
| Operating Temperature Grade | — | E2 (Enhanced, -40C to +100C) |
| Configuration Memory Technology | — | SRAM-based (volatile, requires external boot flash) |
| Recommended Toolchain | — | Intel Quartus Prime |