10AX115N2F40E1SG - Arria 10 GX 1.15M LE FPGA 1517-FCBGA | Intel
Teilenummer: 10AX115N2F40E1SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $3950 | $39.500,00 |
| 100 | $3700 | $370.000,00 |
| 500 | $3500 | $1.750.000,00 |
| 1.000 | $3325 | $3.325.000,00 |
10AX115N2F40E1SG Übersicht
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program after manufacture to implement custom digital circuits. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy: ASIC -> FPGA -> DSP -> MPU/MCU. Unlike ASICs, FPGAs ship with no application logic - the user loads a configuration bitstream to define functionality, making them ideal for prototyping, low-volume production, and workloads needing hardware-level parallelism.
Key features of the 10AX115N2F40E1SG include 24 high-speed transceivers supporting data rates up to 17.4 Gbps (chip-to-chip), hard PCI Express Gen3 IP blocks, dedicated DSP blocks with variable-precision arithmetic support, and up to 3.9 TFLOPs of single-precision floating-point performance per device. The 0.9 V core voltage, 20 nm process, and hardened memory/DSP blocks deliver an industry-leading performance-per-watt envelope for transceiver-rich designs.
Architecturally, the Arria 10 GX family uses Intel's adaptive logic module (ALM) structure with 8-input fracturable look-up tables, distributed MLAB memory, M20K block RAM, and embedded hard IP for PCIe Gen3 and 10/40G Ethernet MACs. The 1517-ball FCBGA package measures 40 mm x 40 mm with 1.0 mm ball pitch, and integrates a high-performance transceiver tile array across the device perimeter.
Typical applications include 10G/40G Ethernet networking line cards, broadcast video processing (4K/8K UHD), radar signal processing in defense systems, ASIC prototyping, and high-performance computing (HPC) acceleration cards. The combination of hardened PCIe Gen3 and multi-rate transceivers reduces external component count and BOM cost in communications infrastructure.
When designing with this device, ensure the PCB layout supports the 1.0 mm ball-pitch FCBGA with matched-length impedance-controlled transceiver lanes, and provide adequate thermal dissipation through the exposed-die package. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure - the device is supported in Quartus Prime Standard Edition.
Drop-in-Alternativen für 10AX115N2F40E1SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115N2F40E1SG (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Speed Grade, Embedded Memory, Transceivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115N1F40E1SG
✅ Drop-In✓ Auf Lager
$6995 / Stück
Datenblatt ansehen →10AX115N1F40I1SG
✅ Drop-In✓ Auf Lager
$3450 / Stück
Datenblatt ansehen →10AX115N1F45E1SG
✅ Drop-In✓ Auf Lager
$6866.23 / Stück
Datenblatt ansehen →10AX115N1F45I1SG
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$5120 / Stück
Datenblatt ansehen →10AX115N2F40E1SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,600 |
| Maximum User I/O Pins | 600 |
| Maximum Transceiver Data Rate | 17.4 Gbps (chip-to-chip) |
| Hard PCIe IP Blocks | PCIe Gen3 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Gehäuse | 1517-BBGA, FCBGA (F40) |
| Package Dimensions | 40 mm x 40 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | N2 |
| Temperature Grade | E1 (commercial) |
| Betriebs-Sperrschichttemperatur | -40C to +100C |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
10AX115N2F40E1SG 40 mm x 40 mm Pinbelegungsleitfaden
Pinbelegung für 10AX115N2F40E1SG (40 mm x 40 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115N2F40E1SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115N2F40E1SG ist geeignet für 6 Anwendungs: 10G/40G Ethernet Networking Line Cards, 4K/8K UHD Broadcast Video Processing, Radar and Defense Signal Processing, ASIC Prototyping and Emulation, High-Performance Computing (HPC) Acceleration, Industrial Test and Measurement Instrumentation.
10G/40G Ethernet Networking Line Cards
The 10AX115N2F40E1SG fits 10G/40G Ethernet line cards because it integrates 17.4 Gbps transceivers with hardened PCS/PMA blocks for 10GBASE-R/40GBASE-R and 40G KR4/KP4 backplanes. Its 1.15M logic elements provide ample pipeline depth for MAC, FEC (RS-FEC), and packet processing; the 68.86 Mbit embedded buffer pool supports cut-through switching architectures. The hard PCIe Gen3 x8 IP block enables direct connection to switch ASICs. The F40 FCBGA's 600 user I/Os accommodate up to 12 QSFP28 cages with full per-port LED/status signaling.
Empfohlen
4K/8K UHD Broadcast Video Processing
The 10AX115N2F40E1SG is well suited for 4K/8K broadcast video processing where it performs real-time de-interlacing, scaling, color space conversion, and HDR metadata insertion across multiple parallel streams. Its 1.15M logic elements combined with hardened DSP blocks enable 12G-SDI (SMPTE ST 2082) jitter-cleaning and HEVC/H.265 intra-frame prediction in a single chip. The 68.86 Mbit embedded memory provides 4K line buffers without external DRAM in many configurations, while 17.4 Gbps transceivers support SDI-over-IP (SMPTE ST 2110) and 25G Ethernet broadcast fabrics.
Empfohlen
Radar and Defense Signal Processing
The 10AX115N2F40E1SG serves radar and defense signal processing with deterministic low-latency DSP pipelines for phased-array beamforming, pulse compression, and SAR processing. Its hardened variable-precision DSP blocks support both fixed-point and IEEE 754 single-precision floating-point arithmetic, enabling adaptive beamforming with complex weight updates in microseconds. The 600 I/O count supports multi-channel ADC/DAC interfaces (JESD204B/C) at sample rates up to 6 Gbps per lane. The E1 commercial temperature grade (-40C to +100C) suits most ground-based and naval installations; industrial-grade variants like 10AX115N1F40I1SG are recommended for harsher environments.
Empfohlen
ASIC Prototyping and Emulation
The 10AX115N2F40E1SG works well for ASIC prototyping where it emulates multi-million-gate ASIC designs partitioned across multiple FPGAs using high-speed transceiver channels for inter-chip communication. Its 1.15M logic elements can map approximately 3-4M ASIC gates, while the 17.4 Gbps transceivers sustain 10+ Gbps inter-FPGA serial links required for partitioned ASIC prototyping. Quartus Prime's incremental compile and LogicLock regions streamline physical synthesis across prototype iterations, and the F40 FCBGA provides enough I/O for high-pin-count ASIC prototypes.
Empfohlen
High-Performance Computing (HPC) Acceleration
The 10AX115N2F40E1SG delivers high-performance compute acceleration for financial analytics, genomics, and machine learning inference via its hardened DSP blocks supporting single-precision floating-point and INT8/INT16 inference. PCIe Gen3 x8 hard IP connects directly to host CPUs at 8 Gbps line rate, and the 17.4 Gbps transceivers support high-bandwidth memory (HBM) or NVMe-over-Fabrics fabrics. The 1.15M logic elements accommodate large custom compute pipelines while 68.86 Mbit embedded memory sustains burst-rate access patterns without external DRAM pressure.
Empfohlen
Industrial Test and Measurement Instrumentation
The 10AX115N2F40E1SG fits industrial T&M instrumentation such as protocol-aware oscilloscopes, BERT testers, and protocol analyzers where it performs real-time signal conditioning, protocol decoding, and statistical analysis across hundreds of channels. Its 600 user I/Os accommodate multi-channel digitizer interfaces (LVDS, LVCMOS), while the 17.4 Gbps transceivers capture 10/40 GbE traffic for protocol analysis. The E1 commercial temperature grade is suitable for laboratory environments; for field-deployed test gear, industrial-grade variants like 10AX115N1F40I1SG are recommended.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115N2F40E1SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115N1F40E1SG | 10AX115N1F40I1SG | 10AX115N1F45E1SG |
|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F45) - different |
| Brand | Intel | Intel | Intel | Intel |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,600 bits | 68,857,600 bits | 68,857,600 bits | 68,857,600 bits |
| Maximum User I/O | 600 | 600 | 600 | 688 |
| Speed Grade | N2 | N1 (slower) | N1 (slower) | N1 (slower) |
| Temperature Grade | E1 (commercial) | E1 (commercial) | I1 (industrial) | E1 (commercial) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm |
| Hard PCIe IP | PCIe Gen3 | PCIe Gen3 | PCIe Gen3 | PCIe Gen3 |
Wichtigste Unterscheidungsmerkmale
- Drop-in F40 package alternative with relaxed speed grade (vs. 10AX115N1F40E1SG)
- Industrial temperature grade variant for harsh environments (vs. 10AX115N1F40I1SG)
- Hard PCIe Gen3 IP block eliminates external PHY (vs. Cyclone V GX FPGAs)
Designhinweise
The 1517-ball F40 FCBGA package has a theta_JA in the range of 8-12 C/W with a properly designed heatsink and thermal interface material. At full transceiver and DSP utilization, the device can dissipate 15-20 W. Use a forced-air cooling solution or heatsink attached with thermal compound, and ensure the PCB has adequate thermal vias beneath the package's thermal pad to spread heat into inner copper planes.
Route all 17.4 Gbps transceiver lanes as 100 ohm differential pairs with controlled impedance (5 mil/8 mil stackup typical), keep length matching to within 5 mils across the entire channel including connector breakouts. Use blind/buried vias for layer transitions to minimize stubs. Reference each transceiver lane to a continuous ground plane; avoid splits above 5 Gbps. Decouple each transceiver bank with 100 nF and 10 uF capacitors placed within 100 mils of the supply pins.
Common pitfalls with Arria 10 GX designs: (1) Forget to apply MSEL pin settings for the chosen configuration mode (AS x4, FPP x8, JTAG) - check the configuration user guide; (2) Use single-ended clock for transceiver reference clock instead of low-jitter LVDS - causes link instability; (3) Skip PCIe reference clock termination if using PCIe Gen3 hard IP - violates electrical spec; (4) Place configuration flash too far from the FPGA, causing AS configuration failures - keep flash within 6 inches.
For PCIe Gen3 and 10G Ethernet designs, follow Intel's transceiver signal integrity guidelines strictly. Use HyperLynx or ANSYS SI to verify channel loss is below 8 dB at 8 GHz Nyquist, and pre-emphasis/de-emphasis settings are properly tuned. Maintain DC blocking capacitors (100 nF) at every transmitter output; missing caps cause duty-cycle distortion at 10+ Gbps. Cross-talk from adjacent lanes should be below -30 dB at 5 GHz - increase ground via fence density if needed.
The 1.0 mm ball-pitch FCBGA needs microvia or HDI PCB stackup - 4-layer FR-4 standard stackup cannot reliably fan out 1517 balls at this density. Plan for 8-12 layer HDI stackup with stacked microvias from BGA breakout to inner layers. Separate analog supplies (transceiver PLLs, ADC reference) with ferrite beads from digital supplies; route sensitive analog grounds to a separate island tied at a single point to the main ground near the FPGA.
Compliance-Informationen
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - this is an FPGA for industrial/comms, not automotive grade. Industrial temperature variants (I1 suffix) are recommended for harsh-environment deployments.