10M08DAF484I7P vs 10M08DAF484I7G Vergleich
Detaillierter Direktvergleich von 10M08DAF484I7P von Intel und 10M08DAF484I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DAF484I7P | 10M08DAF484I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,10 | $25,80 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 | 8000 |
| Embedded Memory | 378 Kbits (46,080 M9K bits) | — |
| User I/O Count | 250 | — |
| Gehäuse | 484-ball FBGA (F484) | — |
| Pitch | 1.0 mm | — |
| Core Voltage | 1.0 V | — |
| Speed Grade | -7 | — |
| Betriebstemperatur | -40 C to +100 C (Industrial) | -40 °C to +100 °C (Industrial) |
| On-chip Configuration Flash | Yes, dual-boot | — |
| Embedded ADC | 12-bit, 1 Msps, 16 channels | — |
| DSP Blocks | Yes (24 x 18-bit multipliers) | — |
| PLLs | 4 | — |
| Maximum LVDS Channels | [DATA_NEEDED: per-bank LVDS channel count] | — |
| User Flash | 8 Kbits (non-volatile) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | MAX 10 |
| Embedded Memory (bits) | — | 387072 |
| Embedded Memory (Kb) | — | 378 |
| Number of I/Os | — | 250 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| Supply Voltage - Core | — | 1.2 V |
| Gehäuse / Bauform | — | 484-BGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| Process Technology | — | 55 nm |
| Lead Free | — | Yes |
| Configuration Memory | — | Internal flash (non-volatile) |