10M08DAF484I7P vs 10M08DAF484I7G Comparación
Comparación detallada lado a lado de 10M08DAF484I7P por Intel y 10M08DAF484I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DAF484I7P | 10M08DAF484I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $22,10 | $25,80 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 | 8000 |
| Embedded Memory | 378 Kbits (46,080 M9K bits) | — |
| User I/O Count | 250 | — |
| Encapsulado | 484-ball FBGA (F484) | — |
| Pitch | 1.0 mm | — |
| Core Voltage | 1.0 V | — |
| Speed Grade | -7 | — |
| Temperatura de funcionamiento | -40 C to +100 C (Industrial) | -40 °C to +100 °C (Industrial) |
| On-chip Configuration Flash | Yes, dual-boot | — |
| Embedded ADC | 12-bit, 1 Msps, 16 channels | — |
| DSP Blocks | Yes (24 x 18-bit multipliers) | — |
| PLLs | 4 | — |
| Maximum LVDS Channels | [DATA_NEEDED: per-bank LVDS channel count] | — |
| User Flash | 8 Kbits (non-volatile) | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | MAX 10 |
| Embedded Memory (bits) | — | 387072 |
| Embedded Memory (Kb) | — | 378 |
| Number of I/Os | — | 250 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| Supply Voltage - Core | — | 1.2 V |
| Encapsulado / Carcasa | — | 484-BGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| Process Technology | — | 55 nm |
| Lead Free | — | Yes |
| Configuration Memory | — | Internal flash (non-volatile) |