10M08DAU324I7G - MAX 10 FPGA, 8K LE, 246 I/O, 324-BGA | Intel
Teilenummer: 10M08DAU324I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.2 | $382,00 |
| 100 | $31.75 | $3.175,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $22.1 | $22.100,00 |
10M08DAU324I7G Übersicht
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that uses look-up tables (LUTs), programmable interconnect, and I/O cells to implement arbitrary digital logic. Within the broader semiconductor hierarchy, FPGAs sit between application-specific integrated circuits (ASICs) and microcontrollers: more flexible than ASICs but more deterministic and parallel than MCUs. The MAX 10 series is Intel's low-cost, instant-on, non-volatile FPGA line optimized for I/O expansion, bridge/replacement, and motor control in industrial, automotive, and consumer markets.
Key features include 8K logic elements, 378 Kbits of embedded SRAM (M9K blocks), 1.4 Mb of user flash, integrated dual 12-bit ADCs (1 MSPS), and DSP blocks with up to 18x18 multipliers. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, with hot-socketing capability and 3.0/3.3 V LVDS on the 324-pin BGA. Configuration is instant-on from internal flash, eliminating external boot components.
The 10M08 is fabricated on TSMC 55 nm embedded flash process technology, providing single-chip, low-power operation with typical core current under 100 mA and on-chip voltage regulation. It supports JTAG (IEEE 1149.1) and passive serial configuration, and includes a 10/100/1000 Ethernet hard IP block (MAC + PCS) plus embedded multipliers optimized for cost-sensitive DSP workloads.
Typical applications include industrial I/O expansion and bridge/replacement, low-cost motor control, video processing and display interfaces, portable medical devices, and consumer electronics requiring instant-on custom logic. The on-chip ADC and flash storage make the 10M08 a true single-chip SoC FPGA solution.
When designing with the 10M08, pay careful attention to the 324-ball BGA fan-out and PCB escape routing; the 1.0 mm ball pitch requires microvia or via-in-pad technology. The internal flash can store both configuration and user data, simplifying BOM and enabling in-field updates via JTAG or a soft CPU such as the Nios II embedded processor.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10M08DAU324I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M08DAU324I7G (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Operating Temperature, Configuration Memory, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M08DAU324C8G
✅ Drop-In✓ Auf Lager
$11.4 / Stück
Datenblatt ansehen →10M08DAF484I7G
✅ Drop-In✓ Auf Lager
$25.8 / Stück
Datenblatt ansehen →10M08DAU324I7P
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M04DAU324I7G
✅ Drop-In✓ Auf Lager
$13.5 / Stück
Datenblatt ansehen →10M08SCU324C8G
✅ Drop-In✓ Auf Lager
$14.2 / Stück
Datenblatt ansehen →LCMXO2-1200HC-4MG132C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M08DAU324I7G Grenzwerte & elektrische Eigenschaften
| Series | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks) | 378 Kbits |
| User Flash Memory | 387,072 bits |
| Maximum User I/O | 246 |
| Gehäuse | 324-LFBGA (UBGA), 1.0 mm pitch |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Supply Voltage (Core) | 1.2 V typical |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V |
| Process Technology | TSMC 55 nm embedded flash |
| DSP Blocks (18x18 Multipliers) | 24 |
| PLLs | 4 |
| On-chip ADC | Dual 12-bit, 1 MSPS |
| Configuration | Internal flash, JTAG, Passive Serial |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| MSL-Level | 3 |
10M08DAU324I7G 324-lfbga (ubga), 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für 10M08DAU324I7G (324-lfbga (ubga), 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M08DAU324I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M08DAU324I7G ist geeignet für 7 Anwendungs: Industrial I/O Expansion and Bridge, Low-Cost Motor Control and Drive, Video Processing and Display Interfaces, Portable Medical Device Control, Consumer Electronics Custom Logic, Automotive Infotainment and Body Electronics, Communications Protocol Bridging.
Industrial I/O Expansion and Bridge
The 10M08DAU324I7G is well suited for industrial I/O expansion, glue logic, and protocol bridging between legacy and modern interfaces. Its 8,000 logic elements, 246 user I/Os, and integrated flash enable instant-on custom logic bridging SPI to UART, I2C to parallel, and GPIO expansion for PLC and factory automation backplanes. The industrial -40C to +100C temperature range supports harsh factory floor environments. Companion components include RS-485 transceivers like MAX3485, digital isolators such as ADuM1411, and the Nios II soft-core CPU IP for on-chip control logic. Unlike discrete logic ICs, the 10M08 integrates configuration and user data in 387 Kbits of on-chip flash, simplifying the BOM and enabling in-field firmware updates.
Empfohlen
Low-Cost Motor Control and Drive
The 10M08DAU324I7G delivers dedicated hardware resources for low-cost BLDC, PMSM, and stepper motor control including 24 18x18 DSP multipliers, 4 PLLs, and dual 12-bit 1 MSPS ADCs for current and voltage sensing. The industrial temperature grade and 55 nm embedded flash process handle the thermal and reliability demands of motor drives. Typical designs use the 10M08 to generate PWM waveforms, decode quadrature encoder feedback, and run field-oriented control (FOC) algorithms. Companion components include gate drivers like IR2104 for MOSFET half-bridges, op-amps such as OPA2333 for current-sense amplification, and Hall-effect sensors for rotor position feedback.
Empfohlen
Video Processing and Display Interfaces
The 10M08DAU324I7G handles LVDS-based video bridging, image processing pipelines, and display controller functions in cost-sensitive embedded vision applications. Its 246 user I/Os accommodate parallel RGB, LVDS, and CSI-2 camera interfaces, while the integrated flash stores lookup tables and gamma correction curves. The 1 MSPS on-chip ADC can sample control voltages or backlight feedback. Typical designs use the 10M08 to bridge HDMI to LVDS panels, perform on-screen display overlay, or implement frame-rate conversion. Companion components include HDMI transmitters like TFP401, LVDS serializers such as SN65LVDS84A, and DDR2 memory for frame buffering.
Empfohlen
Portable Medical Device Control
The 10M08DAU324I7G enables portable medical devices such as patient monitors, infusion pumps, and handheld diagnostic instruments that require deterministic real-time response, low power, and a small footprint. Its instant-on flash configuration eliminates boot delays, critical for medical safety. The on-chip dual ADC samples analog physiological signals without an external ADC. The 246 I/Os connect to TFT displays, touch controllers, and wireless modules. Companion components include low-power microcontrollers like STM32L476 for system orchestration, precision op-amps such as AD8628 for signal conditioning, and Bluetooth modules like nRF52832 for wireless connectivity.
Empfohlen
Consumer Electronics Custom Logic
The 10M08DAU324I7G provides instant-on custom logic for consumer electronics including gaming peripherals, smart appliances, and home automation gateways. Its non-volatile flash configuration supports instant power-on without external boot devices, reducing BOM cost. The 8,000 LEs implement LED matrix drivers, capacitive touch controllers, and audio processing pipelines. The on-chip ADC monitors battery voltage and temperature in battery-powered products. Companion components include LED drivers like TLC5941 for addressable lighting, audio codecs such as SGTL5000 for sound output, and Wi-Fi modules like ESP32 for connectivity.
Empfohlen
Automotive Infotainment and Body Electronics
The 10M08DAU324I7G supports automotive body electronics, infotainment auxiliary functions, and rear-seat entertainment systems where -40C to +100C operation and AEC-Q100-style reliability are required. The 10M08 implements CAN/LIN bus bridging, rear-view camera overlay, and instrument cluster graphics acceleration. Note that for safety-critical ADAS or chassis functions, choose the AEC-Q100-qualified Cyclone IV or Cyclone V families instead. Companion components include CAN transceivers like TJA1050 for in-vehicle networking, video amplifiers such as THS7374 for camera signal conditioning, and automotive-grade power supplies like TPS5430.
Empfohlen
Communications Protocol Bridging
The 10M08DAU324I7G excels at communications protocol bridging for routers, base stations, and industrial networking equipment. Its 246 I/Os and embedded 10/100/1000 Ethernet MAC hard IP enable glue logic between PHY, switch, and CPU. The 24 DSP blocks handle packet header parsing and CRC computation. The instant-on flash supports secure boot with bitstream encryption. Companion components include Ethernet PHYs like DP83848 for 10/100 Mb/s, SRAM memories such as CY7C1061 for packet buffering, and supervisory circuits like TPS3808 for reset generation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M08DAU324I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M08DAU324C8G | 10M08DAF484I7G | 10M08SCU324C8G | 10M04DAU324I7G | LCMXO2-1200HC-4MG132C |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Package | 324-LFBGA (UBGA), 1.0 mm pitch | 324-LFBGA (UBGA) - same | 324-LFBGA compatible subset of F484 | 324-LFBGA (UBGA) - same | 324-LFBGA (UBGA) - same | 132-csBGA - different package, verify pinout |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) | 1,280 LUTs (-84%) |
| Embedded Memory | 378 Kbits M9K | 378 Kbits | 378 Kbits | 378 Kbits | 189 Kbits (-50%) | 64 Kbits (-83%) |
| User Flash | 387 Kbits | 387 Kbits | 387 Kbits | 387 Kbits | 193 Kbits (-50%) | 0 (external boot required) |
| On-chip ADC | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | None (SC variant) | Dual 12-bit, 1 MSPS | None |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Maximum User I/O | 246 | 246 | Up to 250 | 246 | 246 | Up to 80 |
| DSP Multipliers (18x18) | 24 | 24 | 24 | 24 | 16 (-33%) | 0 |
| Price (qty-1, USD) | $42.50 | ~$38.00 | ~$48.00 | ~$36.00 | ~$28.00 | ~$7.00 |
Wichtigste Unterscheidungsmerkmale
- On-chip user flash memory eliminates external boot PROM (vs. Lattice LCMXO2-1200HC-4MG132C)
- Dual on-chip 12-bit ADC for analog signal acquisition (vs. Xilinx XC6SLX9-2CPG196C)
- Higher logic density in the same package footprint (vs. 10M04DAU324I7G)
Designhinweise
The 324-LFBGA package uses a 1.0 mm ball pitch, which requires microvia or HDI PCB fabrication technology for reliable fan-out routing. Use a 4-layer or 6-layer stack-up with controlled impedance for high-speed LVDS pairs. The BGA escape routing must accommodate 0.4 mm-pitch microvias between the top and inner layer; ensure your PCB manufacturer's process supports this pitch. According to the Intel MAX 10 pin connection guidelines, all VCCINT and VCCA pins must be decoupled with 100 nF capacitors placed as close to the balls as physically possible.
Estimated: at typical operation with 50 percent logic utilization, 50 percent toggle rate, and 85C ambient, the 10M08 dissipates approximately 0.5 to 1.0 W. The 324-LFBGA package has a theta_JA of approximately 15 C/W with a properly designed thermal pad and PCB thermal vias. Without thermal vias, theta_JA rises above 30 C/W. According to the Intel MAX 10 datasheet, junction temperature must remain below 100C for industrial operation; verify with a thermal simulation in your specific PCB layout. Estimated input values: 1.0 W dissipation, 15 C/W theta_JA, 85C ambient yields 100C junction - at the operating limit.
Do not leave configuration pins floating: MSEL[2:0] must be tied to VCCIO or GND to select the configuration mode. Unused I/O pins should be set as inputs with internal weak pull-up enabled in the Quartus Prime pin assignment to avoid floating inputs. According to the Intel MAX 10 datasheet, the JTAG TCK pin requires a 1 kohm pull-down to prevent inadvertent configuration. Always implement bitstream encryption when the design contains proprietary IP. Verify that all LVDS pairs use matched-length routing within 50 mil tolerance.
The 10M08DAU324I7G requires three supply rails: VCCINT (1.2 V core), VCCA (2.5 V analog supply for PLLs and ADC), and VCCIO (1.2 V to 3.3 V per bank). According to the Intel MAX 10 datasheet, power-on sequencing requires VCCIO to ramp before or simultaneously with VCCINT. Use a sequencer or monotonic supply ramp to avoid latch-up. Decouple each VCCINT pin with 100 nF X7R ceramic; add a 10 uF bulk capacitor per supply near the device. The on-chip voltage regulator allows single 3.3 V supply operation if design constraints permit slightly higher core current.
LVDS and high-speed DDR interfaces on the 10M08 require 100 ohm differential impedance routing with intra-pair length matching of 5 mil or better. For DDR memory interfaces, use the Quartus Prime Timing Analyzer to verify setup/hold margins before tape-out. According to the Intel MAX 10 External Memory Interface Handbook, place reference voltage (VREF) decoupling capacitors every 5 mm along the DDR bus. Series termination resistors (22 to 33 ohm) on LVCMOS outputs reduce overshoot and ringing on long PCB traces.
Compliance-Informationen
RoHS and REACH compliant per Intel product page. Standard MAX 10 family is not AEC-Q100 qualified - for automotive safety-critical applications use the Cyclone IV or Cyclone V families instead. Lead-free and halogen-free per Intel material declaration.
