10M08DAU324I7G vs 10M08SAU324I7G Vergleich
Detaillierter Direktvergleich von 10M08DAU324I7G von Intel und 10M08SAU324I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DAU324I7G | 10M08SAU324I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,10 | $23,40 |
| Series | MAX 10 | — |
| Logic Elements (LE) | 8,000 | 8000 |
| Embedded Memory (M9K blocks) | 378 Kbits | — |
| User Flash Memory | 387,072 bits | — |
| Maximum User I/O | 246 | — |
| Gehäuse | 324-LFBGA (UBGA), 1.0 mm pitch | 324-LFBGA (UBGA-324), 15x15 mm |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V | — |
| Process Technology | TSMC 55 nm embedded flash | — |
| DSP Blocks (18x18 Multipliers) | 24 | — |
| PLLs | 4 | 2 (with up to 4 output taps) |
| On-chip ADC | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS |
| Configuration | Internal flash, JTAG, Passive Serial | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 | — |
| Family | — | MAX 10 FPGA |
| Embedded User Flash | — | 387,072 bits |
| General Purpose SRAM | — | 246 Kbits |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: multiplier count] |
| Maximum User I/O Pins | — | 250 |
| Core Voltage (VCC) | — | 1.2 V |
| Betriebsversorgungsspannung | — | 3 V / 3.3 V |
| Configuration Memory | — | On-die flash (non-volatile) |
| Configuration Interface | — | JTAG (IEEE 1149.1), Active Serial |